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Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.

The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.

If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the contact information page.

Blank forms：
TFOF (DOC 70K)
SNARF (DOC 68K)

The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.

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3DS-IC
	North America
		3DS-IC Bonded Wafer Stacks
			5173		New Standard: Specification for Parameters for Bonded Wafer Stacks
			5174		New Standard: Specification for Identification and Marking for Bonded Wafer Stacks
			5588		Line Item Revision to SEMI 3D2-0113, Specification for Glass Carrier Wafers for 3DS-IC Applications
			TFOF		3DS-IC Bonded Wafer Stacks
		3DS-IC Inspection and Metrology
			5270		New Standard: Guide for Measuring Voids in Bonded Wafer Stacks
			5409		New Standard: Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
			5410		New Standard: Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
			5447		New Standard: Terminology for Measured Geometrical Parameters of Through-Glass Vias (TGVs) in 3DS-IC Structures
			5506		New Standard: Test Method for Measuring Warp, Bow and TTV on Silicon and Glass Wafers Mounted on Wire Grids by Automated Non-Contact Scanning using Laser Scanning Interferometry
			TFOF		3DS-IC Inspection and Metrology
		3DS-IC Thin Wafer Handling
			5175		New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers
			TFOF		3DS-IC Thin Wafer Handling
	Taiwan
		3DS IC Middle End Process Task Force
			5473		New Standard: Guide for Alignment Mark for 3DS-IC Process
			5474		New Standard: Guide for CMP and Micro-bump Processes for Frontside TSV Integration
			TFOF		3DS IC Middle End Process Task Force
		3DS IC Testing Task Force
			5485		New Standard: Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products
			TFOF		3DS IC Testing Task Force
Assembly & Packaging
	Japan
		Handling and Packing Materials for Assembling Advanced Electronic Device under Clean Environment
			TFOF		Handling and Packing Materials for Assembling Advanced Electronic Device under Clean Environment
		JA 450mm Assembly and Test Die Preparation Task Force
			4814		Specification for Tape Frame Cassette for 450 mm Wafer
			4965		New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in The Backend Process
			TFOF		JA 450mm Assembly and Test Die Preparation Task Force
		Leadframe strip size Task Force
			4964		Specification for Leadframe Strip Size
		Packages and Packaging Materials Eco-efficiency Task Force
			TFOF		Packages and Packaging Materials Eco-efficiency Task Force
		Packaging 5 Year Review Task Force
			4867		Reapproval of SEMI G32-94, GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP
			4875		Reapproval of SEMI G57-0302, GUIDELINE FOR STANDARDIZATION OF LEADFRAME TERMINOLOGY
			TFOF		Packaging 5 Year Review Task Force
		Solder Sphere Size Measurement Taskforce
			5294		New Standard: Measurement Method for Solder Sphere Size for Ball Grid Array Package
			TFOF		Solder Sphere Size Measurement Taskforce
		Thin Chip (Die) Bending Strength Measurement Taskforce
			TFOF		Thin Chip (Die) Bending Strength Measurement Taskforce
		Wafer Shipping Container for Assembly & Packaging Task Force (SCAP TF)
			5295		New Standard: Specification for Coin Stack Type Tape Frame Shipper for 300 mm Wafer
			TFOF		Wafer Shipping Container for Assembly & Packaging Task Force (SCAP TF)
Automated Test Equipment
	North America
		NA ATE 5-Year Review
			5275		Reapproval of SEMI G79-0200, Specification for Overall Digital Timing Accuracy
			5276		Reapproval of SEMI G80-0200, Test Method for the Analysis of Overall Digital Timing Accuracy for Automated Test Equipment
			TFOF		NA ATE 5-Year Review
		Standard Test Data Format (STDF) Task Force
			4782		New Standard for Memory STDF
			TFOF		Standard Test Data Format (STDF) Task Force
		Test Cell Communications
			TFOF		Test Cell Communications
Compound Semiconductor Materials
	Europe
		Carbon in gallium arsenide, FTIR determination
			5498		Line Item Revision to SEMI M82-0712: Test Method for the Carbon Acceptor Concentration in Semi-Insulating Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy
			TFOF		Carbon in gallium arsenide, FTIR determination
		Determination of Dislocation Etch Pit Density in Monocrystals of III-V-Compound Semiconductors
			4810		New Document on Determination of Dislocation Etch Pit Density in Monocrystals of III-V-Compound Semiconductors
			5499		Revision to SEMI M83: Determination of Dislocation Etch Pit Density in Monocrystals of III-V-Compound Semiconductors
			TFOF		Determination of Dislocation Etch Pit Density in Monocrystals of III-V-Compound Semiconductors
		EU Compound Semiconductor Materials Committee
			TFOF		EU Compound Semiconductor Materials Committee
		GaSb Task Force
			TFOF		GaSb Task Force
		SiC Material and Wafer Specification TF
			5370		Specification for 150mm Silicon Carbide single-crystalline substrates
			TFOF		SiC Material and Wafer Specification TF
	North America
		GaAs/M9 Task Force
			TFOF		GaAs/M9 Task Force
		Gallium Nitride (GaN) Task Force
			4979		New Standard: Specification for Round, Polished GaN Wafers
			TFOF		Gallium Nitride (GaN) Task Force
		NA Compound Semiconductor Materials Committee
			5544		Revision of SEMI M9.1-96E (Reapproved 0308), Standard for Round 50.8 mm Polished Monocrystalline Gallium Arsenide Wafers for Electronic Device Applications
			5545		Revision of SEMI M9.2-96E (Reapproved 0308), Standard for Round 76.2 mm Polished Monocrystalline Gallium Arsenide Wafers for Electronic Device Applications
			5546		Revision of SEMI M9.5-96E (Reapproved 0308), Standard for Round 100 mm Polished Monocrystalline Gallium Arsenide Wafers for Electronic Device Applications
			5547		Revision of SEMI M9.6-95E (Reapproved 0308), Standard for Round 125 mm Diameter Polished Monocrystalline Gallium Arsenide Wafers
			5593		Line Item Revision to SEMI M9.7-0708, Specification for Round 150 mm Diameter Polished Monocrystalline Gallium Arsenide Wafers (Notched)
			TFOF		NA Compound Semiconductor Materials Committee
		Silicon Carbide Task Force
			4689		5-year review of SEMI M55, M55.1, and M55.2
			5220		New Standard: Test Method for Measuring Vanadium Concentration in Silicon Carbide by Secondary Ion Mass Spectrometry
			TFOF		Silicon Carbide Task Force
EH&S
	Japan
		FPD System Safety Task Force
			TFOF		FPD System Safety Task Force
		GHG Emission Characterization Task Force
			4712		New Standard: Guide for GHG (Greenhouse Gas) Emission Characterization
			TFOF		GHG Emission Characterization Task Force
		Japan Environmental Health and Safety Committee
			5323		Reapproval of SEMI S21-1106E, Safety Guideline for Worker Protection
			5374		Reapproval of SEMI S16-0307, Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life
			TFOF		Japan Environmental Health and Safety Committee
		S13 Revision Task Force
			4976		Revision to SEMI S13-0305, Safety Guideline for Operation and Maintenance Manuals used with Semiconductor Manufacturing Equipment
			TFOF		S13 Revision Task Force
		S17 Revision Task Force
			5353		Revision to SEMI S17-0311, Safety Guideline for Unmanned Transport Vehicle (UTV) Systems
			TFOF		S17 Revision Task Force
		S18 Revision Task Force
			4400		Revision to S18-1102: Environmental, Health, and Safety Guideline for Silane Family Gases Handling
		S23 Revision Task Force
			5513		Revision to SEMI S23-0311, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment
			TFOF		S23 Revision Task Force
		Seismic Protection Task Force
			5556		Line Item Revisions to SEMI S2-0712, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Revisions Related to Section 19 Seismic Protection
			TFOF		Seismic Protection Task Force
	North America
		Ergonomics Task Force
			4604		Changes to S8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment, related to manual material handling assessments
			5009		Revisions to SEMI S8-0308, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment (Revisions related to the SESC checklist)
			TFOF		Ergonomics Task Force
		Fail-Safe / Fault-Tolerant
			5467		Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment and other normative S references and SEMI S22, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment for fail-safe fault tolerant
			TFOF		Fail-Safe / Fault-Tolerant
		Fire Protection Task Force
			5591		Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed revisions related to fire code criteria
			TFOF		Fire Protection Task Force
		Lifting Equipment Task Force
			TFOF		Lifting Equipment Task Force
		Manufacturing Equipment Safety Subcommittee
			TFOF		Manufacturing Equipment Safety Subcommittee
		NA Environmental Health and Safety Committee
			5521		Reapproval of SEMI S1-0708E, Safety Guideline for Equipment Safety Labels
			5590		Reapproval of SEMI S14-0309, Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment
			TFOF		NA Environmental Health and Safety Committee
		S2 Chemical Exposure Task Force
			4683		Revisions to SEMI S2 related to chemical exposure
			TFOF		S2 Chemical Exposure Task Force
		S2 Interlock and Safety Control Systems Reliability Selection
			5000		Creation of an RI related to reliability requirements of interlocks and safety systems
			TFOF		S2 Interlock and Safety Control Systems Reliability Selection
		S2 Ladders & Steps Task Force
			4449		Updating S2 to add criteria pertaining to stairs, ladders, platforms, and fall protection.
			TFOF		S2 Ladders & Steps Task Force
		S2 Non-Ionizing Radiation Task Force
			5357		Line Item Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Non-Ionizing Radiation
			TFOF		S2 Non-Ionizing Radiation Task Force
		S2 to Machinery Directive Mapping Task Force
			4966		Creating a Mapping of SEMI S2 to the Machinery Directive
			TFOF		S2 to Machinery Directive Mapping Task Force
		S22 Task Force
			4316		Coordinated Revisions to align electrical requirements in SEMI S2 and SEMI S22
			TFOF		S22 Task Force
		S25 Revision Task Force
			TFOF		S25 Revision Task Force
		S6 Revision Task Force
			4625		Ventilation Line Item changes to S2
			4975		Revision to SEMI S6, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment (Line item revisions for addressing gas detectors and other concerns)
			5522		Reapproval of SEMI S6-0707E, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment
			TFOF		S6 Revision Task Force
		S7 Evaluator Qualifications Task Force
			4931		Revision to SEMI S7-0310, Safety Guideline for Evaluation Personnel and Evaluating Company Qualifications
			TFOF		S7 Evaluator Qualifications Task Force
	Taiwan
		LED Safety Task Force
			TFOF		LED Safety Task Force
		Environmental Sustainability Task Force
			TFOF		Environmental Sustainability Task Force
		Equipment Safety Task Force
			TFOF		Equipment Safety Task Force
		Gas and Chemical Safety Task Force
			4807		New Standard: Safety Guideline for Hydrogen Handling
			TFOF		Gas and Chemical Safety Task Force
		PV Safety Task Force
			TFOF		PV Safety Task Force
		Seismic Task Force
			TFOF		Seismic Task Force
Facilities
	Japan
		5-year-review TF
			5490		Reapproval of SEMI F102-0306, Guide for Selecting Specifications for Dimension of Components for Surface Mount Gas Distribution Systems
			TFOF		5-year-review TF
		F1 Revision TF
			5026		Revision to SEMI F1-96, Specification for Leak Integrity of High-Purity Gas Piping Systems and Components
			TFOF		F1 Revision TF
		Gas Box Components Joint Task Force
			TFOF		Gas Box Components Joint Task Force
		Japan Gases and Facilities Committee
			5372		Reapproval of SEMI F44-0307, Specification for Machined Stainless Steel Weld Fittings
			5373		Reapproval of SEMI F45-0307, Specification for Machined Stainless Steel Reducing Weld Fittings
			5390		Reapproval of SEMI F106-0308, Test Method for Determination of Leak Integrity of Gas Delivery Systems by Helium Leak Detector
			TFOF		Japan Gases and Facilities Committee
	Korea
		Equipment Cleanness Task Force
			4771		New Standard: Particle Removal Test Method for Equipment Fan Filter Unit (EFFU)
			4922		New Standard: Guide for Equipment Fan Filter Unit (EFFU) Performance
			TFOF		Equipment Cleanness Task Force
	North America
		Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
			5155		New Standard: Guide for Building Information Modeling (BIM) for Semiconductor Capital Equipment
			TFOF		Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
		NA Facilities Committee
			5570		Reapproval of SEMI E51-0200, Guide for Typical Facilities Services and Termination Matrix
			5572		Reapproval of SEMI E6-0303, Guide for Semiconductor Equipment Installation Documentation
			5575		Reapproval of SEMI E70-1103, Guide for Tool Accommodation Process
			5576		Reapproval of SEMI E76-0299, Guide for 300 mm Process Equipment Points of Connection to Facility Services
			5579		Reapproval of SEMI F49-0200 (Reapproved 1108), Guide for Semiconductor Factory Systems Voltage Sag Immunity
			5580		Reapproval of SEMI F50-0200 (Reapproved 1108), Guide for Electric Utility Voltage Sag Performance for Semiconductor Factories
			TFOF		NA Facilities Committee
		SEMI F51 Revision Task Force
			5080		Revision of SEMI F51-0200 - Guide for Elastometric Sealing Technology
			TFOF		SEMI F51 Revision Task Force
Flat Panel Display (FPD) - Mask
	Japan
		Large Size Mask Task Force
			TFOF		Large Size Mask Task Force
Flat Panel Display (FPD) - Materials & Components
	Japan
		Backlight TF
			TFOF		Backlight TF
		Color Filter Depolarization Effect TF
			TFOF		Color Filter Depolarization Effect TF
		Flexible Display Task Force
			4767		New Standard: Terminology of Plastic Substrate for Flexible Display
			5550		New Standard: Guide for Dimensional Measurement of Plastic Films
			5551		New Standard: Measurement Method of Water Vapor Transmission Rate for Plastic Films and Sheets with High Barrier Properties　for Electronic Devices
			TFOF		Flexible Display Task Force
		FPD Color Filter Task Force
			5239		Reapproval of SEMI D19-0305, Test Method for the Determination of Chemical Resistance of Flat Panel Display Color Filters
			5240		Reapproval of SEMI D45-0706, Measurement Methods for Resistance of Resin Black Matrix with High Resistance for FPD Color Filter
			5552		Reapproval of SEMI D13-0708, Terminology for FPD Color Filter Assemblies
			5553		Reapproval of SEMI D29-1101, Test Method for Heat Resistance in Flat Panel Display (FPD) Color Filters
			5554		Reapproval of SEMI D30-0707, Test Method for Light Resistance in Flat Panle Display (FPD) Color Filters
			TFOF		FPD Color Filter Task Force
		Japan FPD Materials and Components Committee
			5115		Reapproval of SEMI D40-0704, Terminology for FPD Substrate Deflection
			TFOF		Japan FPD Materials and Components Committee
		Polarizing Film TF
			5114		New Standard: Test Methods of Antifouling Property and Resistance to Chemical Reagents for FPD Polarizing Film and Its Materials
			5425		Revision to SEMI D46-0706, Terminology for FPD Polarizing Films
			5555		Revision to SEMI D50-0707, Test Method for Surface Hardness of FPD Polarizing Film
			TFOF		Polarizing Film TF
Flat Panel Display (FPD) - Metrology
	Japan
		D31 Revision Task Force
			4913		Revision to D31-1102: Definition of Measurement Index (Semu) for Luminance Mura in FPD Image Quality Inspection
			TFOF		D31 Revision Task Force
	Korea
		Color Assessment
			TFOF		Color Assessment
		Optical Characteristic Measurement Task Force
			5337		New Standard: Test Method for Optical Characteristics of Transparent Display
			TFOF		Optical Characteristic Measurement Task Force
		Tone & Color Task Force
			4571		New Standard:Test Method of PDP Tone and Color Reproduction
			TFOF		Tone & Color Task Force
	Taiwan
		Touch Screen Panel Task Force
			5149		New Standard: Terminology of Touch Screen Panel
		3D Display Gray-to-Gray Cross-talk Task Force
			5292		New Standard: Test Method of Gray-to-Gray Crosstalk for FPD-based Stereoscopic Display
		3D Display Metrology Task Force
			4764		New Standards: Measurement Method of 3D Flat Panel Display with Active Glasses
			4765		New Standards: Measurement Method of 3D Flat Panel Display with Passive Glasses
			TFOF		3D Display Metrology Task Force
		3D Displays G-to-G Cross-talk Performance Task Force
			TFOF		3D Displays G-to-G Cross-talk Performance Task Force
		Ambient Color Gamut Task Force
			5291		New Standard: Test Method of Ambient Color Gamut for FPD in Indoor Environments
			TFOF		Ambient Color Gamut Task Force
		Color Breakup Task Force
			TFOF		Color Breakup Task Force
		e-Paper Display Task Force
			4999		New Standard: Test Methods for Optical Properties of Electronic Paper Displays
			5533		New Standard: Test Methods for Color Properties of Electronic Paper Displays
			TFOF		e-Paper Display Task Force
		LED Backlight Task Force
			TFOF		LED Backlight Task Force
		Mura Task Force
			TFOF		Mura Task Force
		Touch Screen Panel Task Force
			5293		New Standard: Test Method for Positional Accuracy of Touchscreen Pane
			TFOF		Touch Screen Panel Task Force
Gases
	Japan
		5-year-review TF
			5277		Revision to SEMI F82-0304, Specification for Dimension of Mass Flow Controller/Mass Flow Meter for 1.125 Inch Type Surface Mount Gas Distribution Systems
			5278		Revision to SEMI F83-0304, Specification for Dimension of Two Port Components (Except MFC/MFM) for 1.125 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
			5279		Revision to SEMI F84-0304, Specification for Dimension of Three Port Components (Except MFC/MFM) for 1.125 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
			5280		Revision to SEMI F85-0304, Specification for Dimension of One Port Components for 1.125 Inch Type Four Fastener Configuration Surface Mount Gas Distribution Systems
			5281		Revision to SEMI F86-0304, Specification for Dimension of Two Port Components (Except MFC/MFM) for 1.125 Inch Type Four Fastener Configuration Surface Mount Gas Distribution Systems
			5282		Revision to SEMI F87-0304, Specification for Dimension of Three Port Components (Except MFC/MFM) for 1.125 Inch Type Four Fastener Configuration Surface Mount Gas Distribution Systems
			5283		Revision to SEMI F88-0304E, Specification for Dimension of Standard Size Mass Flow Controllers and Mass Flow Meters for 1.5 Inch Type Surface Mount Gas Distribution Systems
			5284		Revision to SEMI F89-0304E, Specification for Dimension of Compact Size Mass Flow Controllers and Mass Flow Meters for 1.5 Inch Type Surface Mount Gas Distribution Systems
			5285		Revision to SEMI F90-0304E, Specification for Dimension of Standard Size Two Port Components (Except MFC/MFM) for 1.5 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
			5286		Revision to SEMI F91-0304E, Specification for Dimension of Compact Size Two Port Components (Except MFC/MFM) for 1.5 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
			5287		Revision to SEMI F92-0304E, Specification for Dimension of Compact Size Three Port Components for 1.5 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
			5288		Revision to SEMI F93-0304E, Specification for Dimension of One Port Components for 1.5 Inch Type Four Fastener Configuration Surface Mount Gas Distribution Systems
			5289		Revision to SEMI F94-0304E, Specification for Dimension of Two Port Components (Except MFC/MFM) for 1.5 Inch Four Fastener Configuration Type Surface Mount Gas Distribution Systems
			5290		Revision to SEMI F95-0304E, Specification for Dimension of Three Port Components for 1.5 Inch Four Fastener Configuration Type Surface Mount Gas Distribution Systems
	North America
		Filters and Purifiers Task Force
			5244		Reapproval of SEMI F21-1102, Classification of Airborne Molecular Contaminant Levels in Clean Environments
			5446		New Standard: Test Method for Determination of Moisture Dry-Down Characteristics of Surface-Mounted and Conventional Gas Delivery Systems by Continuous Wave Cavity Ring-Down Spectroscopy (CW-CRDS)
			5520		Reapproval of SEMI F69-0708 - Test Methods for Transport and Shock Testing of Gas Delivery Systems
			5568		Reapproval of SEMI C14-95 (Reapproved 0309), Test Method for Particle Shedding Performance of 25 cm Gas Filter Cartridges
			5578		Reapproval of SEMI F36-0299 (Reapproved 1104), Guide for Dimensions and Connections of Gas Distribution Components
			TFOF		Filters and Purifiers Task Force
		Gases Specification Task Force
			5505		Line Item Revision to SEMI C58, Specifications and Guidelines for Hydrogen
			TFOF		Gases Specification Task Force
		Heater Jacket Task Force
			TFOF		Heater Jacket Task Force
		Mass Flow Controller Task Force
			5504		Revision of SEMI E52-1012, Practice for Referencing Gases, Gas Mixtures and Vaporizable Materials Used in Digital Mass Flow Controllers
			5569		Reapproval of SEMI E12-0303 (Reapproved 0309), Standard for Standard Pressure, Temperature, Density, and Flow Units Used in Mass Flow Meters and Mass Flow Controllers
			5571		Reapproval of SEMI E56-0309, Test Method for Determining Accuracy, Linearity, Repeatability, Short-Term Reproducibility, Hysteresis, and Deadband of Thermal Mass Flow Controllers
			5573		Reapproval of SEMI E68-0997 (Reapproved 0309), Test Method for Determining Warm-Up Time of Mass Flow Controllers
			5574		Reapproval of SEMI E69-0298 (Reapproved 0309), Test Method for Determining Reproducibility and Zero Drift for Thermal Mass Flow Controllers
			TFOF		Mass Flow Controller Task Force
		Materials of Construction of Gas Delivery Systems Task Force
			5444		Revision of SEMI F72, Test Method for Auger Electron Spectroscopy (AES) Evaluation of Oxide Payer of Wetted Surfaces of Passivated 316L Stainless Steel Components
			5445		Revision of SEMI F60, Test Method for ESCA Evaluation of Surface Composition of Wetted Surfaces of Passivated 316L Stainless Steel Components
			5577		Reapproval of SEMI F105-0708, Guide for Metallic Material Compatibility in Gas Distribution Systems
			TFOF		Materials of Construction of Gas Delivery Systems Task Force
		Pressure Measurement Task Force
			3440		Test Method for Pressure Measurement Devices
			TFOF		Pressure Measurement Task Force
		Surface Mount Sandwich Component Dimensions Task Force
			5595		New Standard: Guide for the Development of Dimensional Standards for “Sandwich” Surface Mount Components
			TFOF		Surface Mount Sandwich Component Dimensions Task Force
HB-LED
	North America
		HB-LED Assembly
			TFOF		HB-LED Assembly
		HB-LED Equipment Automation Interfaces
			5420		New Standard: Specification for Cassettes for 150mm Sapphire wafers used in HB-LED manufacturing
			5468		New Standard: Mechanical Interface Specification for 150 mm HB-LED Load Port
			5469		New Standard: Specification for High Brightness LED Manufacturing Equipment Communication Interface (HB-LED ECI)
			5529		New Standard: Specification of Job Management and Material Management for High Brightness LED Manufacturing Equipment (HB-LED JMMM)
			TFOF		HB-LED Equipment Automation Interfaces
		HB-LED Wafer
			TFOF		HB-LED Wafer
		Impurities and Defects in HB-LED Sapphire Wafers
			TFOF		Impurities and Defects in HB-LED Sapphire Wafers
Information & Control
	Europe
		Process Control Solutions (PCS)
			TFOF		Process Control Solutions (PCS)
	Japan
		AMHS Task Force
			5227		Reapproval of SEMI E82-1106, Specification for interbay/intrabay AMHS SEM (IBSEM)
			5228		Reapproval of SEMI E88-0307 Specification for AMHS storage SEM (Stocker SEM)
			TFOF		AMHS Task Force
		Equipment Information System Security (EISS) Task Force
			5422		New Standard: Guide for Equipment Information System Security
			TFOF		Equipment Information System Security (EISS) Task Force
		GEM 300 Task Force
			5194		Revisions to SEMI E5, SEMI Equipment Communications Standard 2 Message Content (SECS-II). Correcting some errors.
			5423		Revision to SEMI E40.1-1106 (Reapproved 1111) SECS-II Support for Processing Management Standard and SEMI E5-0611E SEMI Equipment Communication Standard 2 Message Content (SECS-II); Add mapping to PPID for RecID
			5538		New Standard: Specification for Production Recipe Cache mechanism to Be Used for Production Recipe Protection and Synchronization between Factory System and Equipment
			TFOF		GEM 300 Task Force
		Information & Control Committee
			5368		Reapproval of SEMI E118-1104E SPECIFICATION FOR WAFER ID READER COMMUNICATION INTERFACE — The WAFER ID READER FUNCTIONAL STANDARD: CONCEPTS, BEHAVIOR AND SERVICE and SEMI E118.1-1104 SPECIFICATION FOR SECS-I AND SECS-II PROTOCOL FOR WAFER ID READER COMMUNICATION INTERFACE STANDARDS
		Predictive Carrier Logistics (PCL) TF
			5486		New Standard: Specification for Predictive Carrier Logistics Information from Equipment to be used for Predictive Carrier Logistics Management
			TFOF		Predictive Carrier Logistics (PCL) TF
		Sensor Bus Task Force
			5369		Revision to SEMI E54.17-0706 (Reapproved 1211): SPECIFICATION OF SENSOR/ACTUATOR NETWORK FOR A-LINK
			TFOF		Sensor Bus Task Force
	Korea
		Diagnostic Data Acquisition Task Force
			TFOF		Diagnostic Data Acquisition Task Force
		GEM 300 Task Force
			4946		Revision to SEMI E87-0709, Specification for Carrier Management (CMS)
			5320		Revision to SEMI E116, Specification for Equipment Performance Tracking
			5386		Revision to SEMI E94-0312, Specification for Control Job Management, Enhancement of Material Redirection Mode
			TFOF		GEM 300 Task Force
	North America
		Diagnostic Data Acquisition Task Force NA
			4829		Revision to SEMI E139.3, XML/SOAP Binding for Recipe and Parameter Management. SOAP 1.2 Support for SEMI E139.3
			5002		New Standard for Common EDA Metadata
			5003		Revisions to: * SEMI E125, Specification for Equipment Self Description (EqSD) * SEMI E128, Specification for XML Message Structures * SEMI E132, Specification for Equipment Client Authentication and Authorization * SEMI E134, Specification for Data Collection Management For reliable messaging for EDA Standards
			5100		Revision to SEMI E132, Specification for Equipment Authorization and Authentication. For introducing the new capability: client password
			5177		Revision to SEMI E145-0306, Classification for Measurement Unit Symbols in XML
			5452		Revisions to SEMI E134, Specification for Data Collection Management and SEMI E134.1, Specification for SOAP Binding of Data Collection Management (DCM)
			5480		Revision to SEMI E164, Specification for EDA Common Metadata
			5507		Revisions to: - SEMI E120, Specification for the Common Equipment Model (CEM), - SEMI E120.1, XML Schema for the Common Equipment Model (CEM), - SEMI E125, Specification for Equipment Self Description (EqSD), - SEMI E125.1, Specification for SOAP Binding for Equipment Self Description (EQSD), - SEMI E128, Specification for XML Message Structures, - SEMI E132, Specification for Equipment Client Authentication and Authorization - SEMI E132.1, Specification for SOAP Binding for Equipment Client Authentication and Authorization (ECA), - SEMI E134, Specification for Data Collection Management - SEMI E134.1, Specification for SOAP Binding of Data Collection Management (DCM), - SEMI E138, XML Semiconductor Common Components - SEMI E145, Classification for Measurement Unit Symbols in XML - SEMI E164, Specification for EDA Common Metadata
			TFOF		Diagnostic Data Acquisition Task Force NA
		Energy Saving Equipment Communication Task Force
			5411		New Standard: Specification for Equipment Energy Saving Mode Communications (EESM)
			5453		New Standard: Specification for SECS-II Protocol for Equipment Energy Saving Mode
			TFOF		Energy Saving Equipment Communication Task Force
		GEM 300 Task Force
			5454		Revisions to SEMI E30, Specification for Generic Equipment Model (GEM) Standard and SEMI E5, SEMI Equipment Communications Standard 2 Message Content (SECS-II)
			5508		Revisions to: - SEMI E5, SEMI Equipment Communications Standard 2 Message Content (SECS-II) - SEMI E90, Specification for Substrate Tracking - SEMI E90.1, Specification for SECS-II Protocol Substrate Tracking
			5509		Revision to SEMI E94, Specification for Control Job Management
			5510		Revision to SEMI E157, Specification for Module Process Tracking
			5549		Revision to SEMI E30, Generic Model for Communications and Control of Manufacturing Equipment (GEM) with title change to: Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)
			5589		Revisions to: - SEMI E30, Generic Model for Communications and Control of Manufacturing Equipment (GEM), - SEMI E30.1, Inspection and Review Specific Equipment Model (ISEM), - SEMI E82, Specification for Interbay/Intrabay AMHS SEM (IBSEM), - SEMI E88, Specification for AMHS Storage SEM (Stocker SEM), - SEMI E91, Specification for Prober Specific Equipment Model (PSEM), - SEMI E122, Standard for Tester Equipment Specific Equipment Model (TSEM), and - SEMI E123.1, Specification for SECS-II Protocol for Handler Specific Equipment Model (HSEM)
			TFOF		GEM 300 Task Force
		NA Information and Control Committee
			5455		Reapproval of SEMI E37.1-0702 (Reapproved 0308), High-Speed SECS Message Services Single Selected-Session Mode (HSMS-SS)
			5456		Reapproval of SEMI E54.1-0708, Standard for Sensor/Actuator Network Common Device Model
			5457		Reapproval of SEMI E126-0708, Specification for Equipment Quality Information Parameters (EQIP)
			5458		Reapproval of SEMI E139.2-1108, SECS-II Protocol for Recipe and Parameter Management (RaP)
			5511		Reapproval of SEMI E54.20, Standard for Sensor/Actuator Network Communications for EtherCAT
			TFOF		NA Information and Control Committee
		Process Control System NA
			4507		Revisions to SEMI E133, Provisional Specification for Automated Process Control Systems Interface and SEMI E133.1, Provisional Specification for XML Messaging for Process Control Systems (PCS). For fault detection enhancements
			4692		Revision to SEMI E133, Provisional Specification for Automated Process Control Systems Interface. Line item changes and enhancements to E133: Fault Prediction Enhancements.
			TFOF		Process Control System NA
		Sensor Bus Task Force
			5181		New E54.x Subordinate Standard: Specification for CC-Link Industrial Ethernet (IE) Field Network
			5274		New SEMI E54 Subordinate Standard: Specification for Sensor/Actuator Network Specific Device Model for Generic Equipment add-on Sensor (ADDON)
			TFOF		Sensor Bus Task Force
		Sort Map Task Force
			5104		Revisions to: * SEMI E142, Specification for Substrate Mapping * SEMI E142.1, XML Schema for Substrate Mapping * SEMI E142.2, SECS-II Protocol for Substrate Mapping * SEMI E142.3, Web Services for Substrate Mapping
			TFOF		Sort Map Task Force
Liquid Chemicals
	Europe
		EU Gases and Liquid Chemicals Committee
			TFOF		EU Gases and Liquid Chemicals Committee
		Precursor Specifications Task Force
			5325		New Standard: Guide For Dimethyl Dimethoxy Silane (DMDMOS)
			5327		New Standard: Guide for Monomethyl Silane
			5491		New Standard: Guide for Titanium Tetrachloride (TiCl4)
			5493		New Standard: Guide for Octa Methyl Cyclo Tetra Siloxane (OMCTS)
			5494		New Standard: Guide for Tetra Methyl Cyclo Tetra Siloxane (TMCTS)
			5496		Line Item Revision to SEMI C80-0113, Guide for Tetrakis(Dimethylamino) Silane (TDMAS)
			TFOF		Precursor Specifications Task Force
		Solvents in Advanced Processes
			5324		New Standard: Guide for Cyclopentanone
			5326		New Standard: Guide for Methyl Isobutyl Carbinol (MIBC) or 4-Methyl 2-Pentanol
			5492		New Standard: Guide for Ethylene Glycol
			5495		New Standard: Guide for Cyclo Hexanone
			TFOF		Solvents in Advanced Processes
	Japan
		5-year-review Task Force
			5064		Revision to SEMI F66-1101, Specification for Port Marking and Symbol of Stainless Steel Vessels for Liquid Chemicals
			TFOF		5-year-review Task Force
		Diaphragm Valves Task Force
			TFOF		Diaphragm Valves Task Force
		Liquid-Borne Particle Counter Task Force
			TFOF		Liquid-Borne Particle Counter Task Force
		Liquid Filter Task Force
			5297		New Standard: Test Method for Particle Removal Performance of Liquid Filter Rated 20-50 nm with Liquid-borne Particle Counter
			5421		New Standard: Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with ICP-MS
			TFOF		Liquid Filter Task Force
		Welding Fitting Task Force
			5371		New Standard: Test Method for Tensile Strength Applied to Welded Connections Made by PFA Weld Fitting
			TFOF		Welding Fitting Task Force
	North America
		Analytical Methods Task Force
			4544		Revision to SEMI C24-0301, Specification for n-Butyl Acetate
			4957		Revision to SEMI C41-0705, Specifications and Guidelines for 2-Propanol, with title change to: Specifications for 2-Propanol
			5136		Reapproval of SEMI C34-0306, Specification and Guideline for Mixed Acid Etchants
			5356		Revision to SEMI C51-0706, Specifications and Guidelines for Xylenes
			5459		Reapproval of SEMI F18-95, Guide for Determining the Hydrostatic Strength of, and Design Basis for, Thermoplastic Pipe and Tubing
			5534		Reapproval of SEMI F8-0998, Test Method for Evaluating the Sealing Capabilities of Tube Fitting Connections Made of Fluorocarbon Materials, When Subjected to Tensile Forces
			5548		Revision to SEMI C36-1107, Specifications for Phosphoric Acid
			TFOF		Analytical Methods Task Force
		Determining Roughness of Polymer Surfaces Task Force
			TFOF		Determining Roughness of Polymer Surfaces Task Force
		F104 Rewrite TaskForce
			5416		Revision of SEMI F104-0312, Particle Test Method Guide for Evaluation of Components Used in Ultrapure Water and Liquid Chemical Distribution Systems
			TFOF		F104 Rewrite TaskForce
		F57 Revision Task Force
			TFOF		F57 Revision Task Force
		F63 Revision Task Force
			TFOF		F63 Revision Task Force
		SEMI F31, F39 & F41 Re-Write Task Force
			5479		Revision to SEMI F31-0698, Guide for Bulk Chemical Distribution Systems
			5528		Revision to SEMI F39-0699, Guideline for Chemical Blending Systems with title change to: Guide for Chemical Blending Systems
			TFOF		SEMI F31, F39 & F41 Re-Write Task Force
		SEMI F40 Rewrite Task Force
			5527		Revision to SEMI F40-0699E, Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing
			TFOF		SEMI F40 Rewrite Task Force
		Statistical Methods Task Force
			5105		New Standard: Guide for Cross Calibrating Particle Measurement Instruments for Liquid Chemicals
			5106		New Standard: Guide for Extrapolating Particle Measurement Data for Liquid Chemicals
		Ultra Pure Water Filtration Efficiency Task Force
			TFOF		Ultra Pure Water Filtration Efficiency Task Force
MEMS / NEMS
	International
		Terminology
			TFOF		Terminology
	North America
		MEMS Material Characterization
			5586		Line Item Revision to SEMI MS2-0212, Test Method for Step Height Measurements of Thin Films
			5587		Line Items Revisions to SEMI MS4-0212, Standard Test Method for Young’s Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance
			TFOF		MEMS Material Characterization
		MEMS Microfluidics
			4819		Standard Test Method for Electroosmotic Mobility in Microfluidic Systems
			5267		New Standard: Specification for Microfluidic Port and Pitch Dimensions
			5268		New Standard: Test Method for Autofluorescence of Materials
			5515		Revision to SEMI MS7-0708, Specification for Microfluidic Interfaces to Electronic Device Packages
			TFOF		MEMS Microfluidics
		MEMS Packaging
			5266		New Standard: Guide for Determining Fluid Permeation through MEMS Packaging Materials
			TFOF		MEMS Packaging
		MEMS Reliability
			4820		Specification for MEMS Reliability Design, Materials Selection, Process and Testing Method
			TFOF		MEMS Reliability
		NA MEMS / NEMS Committee for 5-Year Review
			TFOF		NA MEMS / NEMS Committee for 5-Year Review
		Terminology
			4719		Revision to MS03-07, Terminology for MEMS Technology with title change to: Terminology for MEMS / NEMS Technology
		Wafer Bond
			5514		Line Items Revisions to SEMI MS5-1211, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures
			TFOF		Wafer Bond
Metrics
	Japan
		Cycle Time Metrics Task Force
			4704		Definition of Active Time and Wait Time
			TFOF		Cycle Time Metrics Task Force
	North America
		EMC Task Force
			5596		New Standard: Guide for Semiconductor Manufacturing Facilities Electromagnetic Compatibility (EMC)
			TFOF		EMC Task Force
		Equipment Cost of Ownership TF
			TFOF		Equipment Cost of Ownership TF
		Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
			5340		Revision to SEMI E10-0312, Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
			5341		Revision to SEMI E79-1106, Specification for Definition and Measurement of Equipment Productivity and for Reconciliation with SEMI E10-0312
			5412		Revision to SEMI E58-0703, Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior, and Services for compliance with SEMI E10-0312
			TFOF		Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
		Equipment Training and Documentation Task Force
			5526		Line Item Revisions to SEMI E165-0712, Guide for Comprehensive Equipment Training Systems when Dedicated Training Equipment is not Available
			5597		Revision to SEMI E149-0708, Guide for Equipment Supplier-Provided Documentation for the Acquisition and Use of Manufacturing Equipment
			5598		Revision to SEMI E150-1107, Guide for Equipment Training Best Practices
			TFOF		Equipment Training and Documentation Task Force
		ESD/ESC Task Force- N.A
			5472		Revision to SEMI E43-1108, Recommended Practice for Electrostatic Measurements on Objects and Surfaces with title change to: Guide for Electrostatic Measurements on Objects and Surfaces
			TFOF		ESD/ESC Task Force- N.A
		North America Metrics Technical Committee
			TFOF		North America Metrics Technical Committee
		Wait Time Waste Metrics and Methods (WTW TF)
			5592		New Standard: Specification for Measurement of Product Time in Semiconductor Manufacturing
			TFOF		Wait Time Waste Metrics and Methods (WTW TF)
Micropatterning
	Japan
		5-year-review Task Force
			5483		Reapproval of SEMI P47-0307, Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
			5484		Revision to SEMI P22-0307, Guideline for Photomask Defect Classification and Size Definition
			5535		Reapproval of SEMI P35-1106, Terminology for Microlithography Metrology
			5536		Reapproval of SEMI P36-1108, Guide for Magnification Reference for Critical Dimension Measurement for Scanning Electron Microscopes (CD-SEMS)
			5537		Line Item Revision to SEMI P23-0200 (Reapproved 1107), Guidelines for Programmed Defect Masks and Benchmark Procedures for Sensitivity Analysis of Mask Defect Inspection Systems
			TFOF		5-year-review Task Force
		Mask Data Format for Mask Tools TF
			5229		Revision to SEMI P44, Specification for Open Artwork System Interchange Standard (OASIS) Specific to Mask Tools
			5366		Revision to SEMI P45-0211, SPECIFICATION FOR JOB DECK DATA FORMAT FOR MASK TOOLS
			TFOF		Mask Data Format for Mask Tools TF
	North America
		Data Path
			TFOF		Data Path
		EUV Mask Task Force
			5048		Revision to SEMI P37-1109, Specification for Extreme Ultraviolet Lithography Mask Substrates
			TFOF		EUV Mask Task Force
		EUV Reticle Fiducial Mark Task Force
			TFOF		EUV Reticle Fiducial Mark Task Force
		Mask Orders Task Force
			5460		Revision to SEMI P10, Specification of Data Structures for Photomask Orders
			5561		Revision of SEMI P10-1112, Specification of Data Structures for Photomask Orders
			TFOF		Mask Orders Task Force
		NA Microlithography Committee for 5-Year Review
			5120		Revision to SEMI P12-0997, Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma Emission Spectroscopy (ICP)
			5121		Revision to SEMI P13-91 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresists by Atomic Absorption Spectroscopy
			5122		Revision to SEMI P14-0997, Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption Spectroscopy
			5123		Revision to SEMI P15-92 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy
			5124		Revision to SEMI P16-92 (Reapproved 1104), Determination of Tin in Positive Photoresist Metal Ion Free (MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy
			5125		Revision to SEMI P17-92 (Reapproved 0299), Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP)
			5126		Revision to SEMI P18-92 (Reapproved 1104), Specification for Overlay Capabilities of Wafer Steppers
			5127		Revision to SEMI P24-94 (Reapproved 1104), CD Metrology Procedures
			5145		Reapproval of SEMI P35-1106, Terminology for Microlithography Metrology
			5148		Revision to SEMI P5-0704, Specification for Pellicles
			5271		Revision to SEMI P25-94 (Reapproved 1104), Specification for Measuring Depth of Focus and Best Focus
			5272		Revision to SEMI P28-96 (Reapproved 0707), Specification for Overlay-Metrology Test Patterns for Integrated-Circuit Manufacture
			TFOF		NA Microlithography Committee for 5-Year Review
Photovoltaic
	China
		Anti-reflective Coated Glass Task Force
			5475		New Standard: Specification for Anti-Reflective Coated Glass, Used in Crystalline Silicon Photovoltaic Modules
			TFOF		Anti-reflective Coated Glass Task Force
		Crystalline Silicon PV Module Task Force
			5384		New Standard: Specification for Package protection technology for PV Modules
			5385		New Standard: Test Method for the content of Vinyl Acetate (VA) in Ethylene-Vinyl Acetate (EVA) applied in PV modules—Thermal Gravimetric Analysis (TGA)
			5563		New Standard: Specification for Framing Tape for PV Modules
			TFOF		Crystalline Silicon PV Module Task Force
		Metal Paste for Crystalline Silicon Solar Cells Task Force
			5426		New Standard: Specification for Aluminum Paste, Used in Back Surface Field of Crystalline Silicon Solar Cells
			5427		New Standard: Specification for front surface silver paste, used in P-Type crystalline silicon solar cells
			TFOF		Metal Paste for Crystalline Silicon Solar Cells Task Force
		Polysilicon Packaging Materials Task Force
			5428		New Standard: Specification for Impurities in Polyethylene Packaging Materials for Polysilicon Feedstock
			TFOF		Polysilicon Packaging Materials Task Force
		PV Diffusion Furnace Test Methods TF
			5429		New standard: Test Method for In-line Monitoring of Flat Temperature Zone in Horizontal Diffusion Furnaces
			TFOF		PV Diffusion Furnace Test Methods TF
		PV Silicon Raw Materials Task Force
			5476		New Standard: Test Method for determination of total carbon content in silicon powder by Infrared absorption after combustion in an induction furnace
			5477		New Standard: Test Method for Determining B, P, Fe, Al, Ca Contents in Silicon Powder for PV Applications by Inductively-Coupled-Plasma Optical Emission Spectrometry
			5564		New Standard: Test Method for the Measurement of Chlorine in Silicon by Ion Chromatography
			TFOF		PV Silicon Raw Materials Task Force
		PV Silicon Wafer Task Force
			5382		New Standard: Specification for Quasi-monocrystalline Silicon Wafers used in Photovoltaic Solar Cells
			TFOF		PV Silicon Wafer Task Force
		Silicon Thin Film PV Module Task Force
			5478		New Standard: Test method for thin-film silicon PV modules light soaking
			TFOF		Silicon Thin Film PV Module Task Force
	Taiwan
		Building Integrated Photovoltaic (BIPV) Task Force
			5560		New Standard: Classification of Building Integrated Photovoltaic (BIPV)
			TFOF		Building Integrated Photovoltaic (BIPV) Task Force
		c-Si Cell appearance Task Force
			4833		New Standard: Specification for Color reference cell
			4834		New Standard: Detection of c-Si PV cell surface visible defects
			TFOF		c-Si Cell appearance Task Force
		PV Package Performance Task Force
			5431		New Standard: Test Method for Performance Criteria of Photovoltaic (PV) Wafer, Cell, and Module Package
			TFOF		PV Package Performance Task Force
		PV wafer measurement method Task Force
			TFOF		PV wafer measurement method Task Force
Photovoltaic (PV) - Automation
	Europe
		Photovoltaic – Equipment Interface Specification (PV-EIS)
			5151		New Standard: Specification To Transfer Wafer Mark Reader Data To Host System (MES)
			5153		New Subordinate Standard "Data Definition specifications for a Horizontal Communication between equipment for crystalline photovoltaic fabrication system" (Parent Document is 4804, "SPECIFICATION FOR A HORIZONTAL COMMUNICATION BETWEEN EQUIPMENT FOR PHOTOVOLTAIC FABRICATION SYSTEM")
			5154		New Subordinate Standard "Profibus implementation specification for a Horizontal Communication between equipment for crystalline photovoltaic fabrication system" (Parent Document: 4804 "SPECIFICATION FOR A HORIZONTAL COMMUNICATION BETWEEN EQUIPMENT FOR PHOTOVOLTAIC FABRICATION SYSTEM")
			5339		Specification for Single Material Tracking and Tracing For Crystalline Silicon PV
			5566		Line Item Revision to SEMI PV002-00-0709E Guide for PV Equipment Communication Interfaces (PVECI), modify requirement [PV02-RQ-00007-00] to allow implementation of new namelist requests instead of required documentation.
			TFOF		Photovoltaic – Equipment Interface Specification (PV-EIS)
		PV Wafer Traceability Task Force
			5418		Revision of SEMI PV29-0212, Specification for Front Surface Marking of PV Silicon Wafers with Two-Dimensional Matrix Symbols
			5419		Revision of SEMI PV32-0312, Specification for Marking of PV Silicon Brick Face and PV Wafer Edge
			TFOF		PV Wafer Traceability Task Force
					Revision to PV29-0212, Specification for Front Surface Marking of PV Silicon Wafers with Two-Dimensional Matrix Symbols
	Global
		Global Photovoltaic –Equipment Interface Specification (PV-EIS) TF
			TFOF		Global Photovoltaic –Equipment Interface Specification (PV-EIS) TF
	Japan
		Photovoltaic –Equipment Interface Specification (PV-EIS) TF
			4848		Generic Equipment Model for Thin Film Photovoltaic Manufacturing (GEM-PV)
			5222		New Subordinate Standard: Data Definition Specifications for a Horizontal Communication between Equipment for Larger Sized Substrate Oriented Photovoltaic Fabrication System to Doc.4804 "Specification for a Horizontal Communication between Equipment for Photovoltaic Fabrication System"
			5223		New Subordinate Standard: “Media Interface Specifications for a Horizontal Communication between Equipment” to be Used to Implement SEMI PV35
			TFOF		Photovoltaic –Equipment Interface Specification (PV-EIS) TF
		PV Transport Carrier TF
			TFOF		PV Transport Carrier TF
Photovoltaic (PV) - Materials
	Europe
		International PV Analytical Test Methods Task Force
			5436		Auxiliary Information: Results of Round Robin for SEMI PV10-Test Method for Instrumental Neutron Activation Analysis (INAA) of Silicon
			5440		Revision to SEMI PV10-1110, Test Method for Instrumental Neutron Activation Analysis (INAA) of Silicon
		PV Ribbon Task Force
			TFOF		PV Ribbon Task Force
		PV Silicon Materials Task Force
			5432		New Standard, Test Method for In-Line Characterization of PV Silicon Wafers by Using Photoluminescence
			5433		New Standard, Test Method for In-Line Characterization of PV Silicon Wafers Regarding Grain Size
			5562		Line Item Revision to SEMI PV42, Test Method for In-Line Measurement of Waviness on PV Silicon Wafers by a Light Sectioning Technique Using Multiple Line Segments
			5565		Line Item Revision to PV42, Test Method for In-Line Measurement of Waviness on PV Silicon Wafers by a Light Sectioning Technique Using Multiple Line Segments
			TFOF		PV Silicon Materials Task Force
	Japan
		Japan PV Materials Task Force
			5417		New Standard: Test Method for Measurement of Defects in PV Silicon Wafers in PV Modules by Electroluminescence Imaging
			5532		New Standard: Test Method for Measurement of Cracks in PV Silicon Wafers in PV Modules by Laser Scanning
			TFOF		Japan PV Materials Task Force
	North America
		International PV Analytical Test Methods Task Force
			4675		New Standard: Test Method for the Measurement of Elemental Impurity Concentrations in Silicon Feedstock by Bulk Digestion, Inductively-Coupled-Plasma Mass Spectrometry
			5435		Auxiliary Information to include interlaboratory study for SEMI PV25-1011, Test Method for Simultaneously Measuring Oxygen, Carbon, Boron and Phosphorus in Solar Silicon Wafers and Feedstock by Secondary Ion Mass Spectrometry
			5437		Line item revision of SEMI PV25-1011, Test Method for Simultaneously Measuring Oxygen, Carbon, Boron and Phosphorus in Solar Silicon Wafers and Feedstock by Secondary Ion Mass Spectrometry
			5501		Auxiliary Document: Interlaboratory Study for PV43-0113 - Test Method For The Measurement Of Oxygen Concentration In PV Silicon Materials For Silicon Solar Cells By Inert Gas Fusion Infrared Detection Method
			5567		New Auxiliary Document: Interlaboratory Study for PVxx, Test Method for the Measurement of Elemental Impurity Concentrations in Silicon Feedstock for Silicon Solar Cells By Bulk Digestion, Inductively Coupled-Plasma Mass Spectrometry
			TFOF		International PV Analytical Test Methods Task Force
		PV Electrical & Optical Properties Measurements Task Force
			4825		New Standard: Test Methods for Hg Probe Measurements of Crystalline Silicon PV Materials and Devices
			5093		Auxiliary Document: Round Robin (Multi-laboratory Test) of SEMI PV9-1110 Test Method for Excess Charge Carrier Decay in PV Silicon Materials by Non-Contact Measurement of Microwave Reflectance After a Short Illumination Pulse
			5394		New Standard: Test Method for QSS Microwave PCD measurements of Carrier Decay and Lifetime
			TFOF		PV Electrical & Optical Properties Measurements Task Force
Physical Interfaces & Carriers
	Europe
		EU Equipment Automation Committee (Physical Interfaces & Carriers)
			TFOF		EU Equipment Automation Committee (Physical Interfaces & Carriers)
	International
		Global PIC Maintenance Task Force
			TFOF		Global PIC Maintenance Task Force
		International 450 mm Physical Interfaces & Carriers
			TFOF		International 450 mm Physical Interfaces & Carriers
		International Process Module Physical Interface TF (IPPI-TF)
			TFOF		International Process Module Physical Interface TF (IPPI-TF)
		International Reticle SMIF Pod and Load Port Interoperability Task Force
			TFOF		International Reticle SMIF Pod and Load Port Interoperability Task Force
	Japan
		450 mm AMHS Task Force
			TFOF		450 mm AMHS Task Force
		Global PIC Maintenance Task Force
			5489		Reapproval of SEMI E85-1108, Specification for Physical AMHS Stocker to Interbay Transport System Interoperability
		International Process Module Physical Interface TF (IPPI-TF)
			5488		New Standard: Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard
	North America
		EUV Reticle Handling Task Force
			5262		Revision to SEMI E152-0709, Mechanical Specification of EUV Pod for 150 mm EUVL Reticles
			TFOF		EUV Reticle Handling Task Force
		Global PIC Maintenance Task Force
			5461		Reapproval of SEMI E73-0301 (Reapproved 0307), Specification for Vacuum Pump Interfaces - Dry Pumps
			5462		Reapproval of SEMI E74-0301 (Reapproved 0307), Specification for Vacuum Pump Interfaces - Turbomolecular Pumps
			5464		Revision to SEMI E154-0612, Mechanical Interface Specification for 450 mm Load Port
			5523		Removal of SEMI E7-91 (Withdrawn 0312) - Specification for Electrical Interfaces for the U.S. Only
		International 450 mm Physical Interfaces & Carriers
			4639		Next Generation Carrier Hand-off
			5263		Revisions to SEMI E158-1110, Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (450 FOUP) and Kinematic Coupling, and SEMI E159-0611, Mechanical Specification for Multi Application Carrier (MAC) Used to Transport and Ship 450mm Wafers
			5463		Revision to SEMI E83-1106, Specification for 300 mm PGV Mechanical Docking Flange with title change to: Specification for PGV Mechanical Docking Flange
			5524		Line item revisions to SEMI E156-0710, Mechanical Specification for 450 mm AMHS Stocker to Transport Interface
			5557		Revision to SEMI AUX023-1211, Overview Guide to SEMI Standards for 450mm Wafers
		International Reticle SMIF Pod and Load Port Interoperability Task Force
			5261		Revisions to: SEMI E111, Mechanical Specification for a 150 mm Reticle SMIF Pod (RSP150) Used to Transport and Store a 6 Inch Reticle SEMI E112, Mechanical Specification for a 150 mm Multiple Reticle SMIF Pod (MRSP150) Used to Transport and Store Multiple 6 Inch Reticles SEMI 19, Standard Mechanical Interface (SMIF) SEMI E19.4, 200 mm Standard Mechanical Interface (SMIF) Improving RSP sensing on RSP load ports
			5465		Revision to SEMI E111-1106, Mechanical Specification for a 150 mm Reticle SMIF Pod (RSP150) Used to Transport and Store a 6 Inch Reticle
			5466		Revision to SEMI E112-1106, Mechanical Specification for a 150 mm Multiple Reticle SMIF Pod (MRSP150) Used to Transport and Store Multiple 6 Inch Reticles
			5584		Revision to SEMI E19-0912, Standard Mechanical Interface (SMIF)
			5585		Revision to SEMI E19.3-0309, Standard Mechanical Interface (SMIF), Specification for 150 mm (6 inch) Port
		NA 450mm Assembly Test Die Prep Task Force
			TFOF		NA 450mm Assembly Test Die Prep Task Force
		NA 450mm Shipping Box Task Force
			5107		Revision to SEMI E159, Mechanical Specification for Multi Application Carrier (MAC) Used to Transport and Ship 450mm Wafers
			TFOF		NA 450mm Shipping Box Task Force
		NA International 300mm Wafer Shipping Box Task Force
			TFOF		NA International 300mm Wafer Shipping Box Task Force
Silicon Wafer
	Europe
		International 450 mm Wafer Task Force
			5071		Revision to M76, Specification for developmental 450 mm diameter polished single crystal silicon wafers
		International Advanced Wafer Geometry Task Force
			4812		New Standard:Guide for Flatness Measurement on 450 mm Wafers
			5091		Revision of SEMI M49-1108 - Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generations (Re:ZDD parameter)
			5430		Revision to SEMI M73-0309 Test Methods for Extracting Relevent Characteristics from Measured Wafer Edge Profiles
		International Polished Wafers Task Force
			5500		New Standard: Specification for Polished Single Crystal Silicon Wafers for GaN-on-Silicon Applications
	International
		International 450 mm Shipping Box
			TFOF		International 450 mm Shipping Box
		International 450 mm Wafer Task Force
			5070		Revision to SEMI M76-0710, Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers
			TFOF		International 450 mm Wafer Task Force
		International Advanced Surface Inspection Task Force
			TFOF		International Advanced Surface Inspection Task Force
		International Advanced Wafer Geometry Task Force
			TFOF		International Advanced Wafer Geometry Task Force
		International Annealed Si Wafer Task Force
			TFOF		International Annealed Si Wafer Task Force
		International Epitaxial Wafers Task Force
			TFOF		International Epitaxial Wafers Task Force
		International Polished Wafers Task Force
			TFOF		International Polished Wafers Task Force
		International SOI Wafers Task Force
			TFOF		International SOI Wafers Task Force
		International Terminology Task Force
			TFOF		International Terminology Task Force
		International Test Methods Task Force
			TFOF		International Test Methods Task Force
	Japan
		International 450 mm Shipping Box
			5069		New Standard: Specification for 450 mm Wafer Shipping System
			5375		Revisions to SEMI M80-1111, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers
		International 450 mm Wafer Task Force
			5112		New Standard: 450 mm Diameter Polished Single Crystal Silicon Wafers for 32 nm IC Manufacturing Node
		International Advanced Wafer Geometry Task Force
			5539		Revision of SEMI MF1390-0707 (Reapproved 0512), Test Method for Measuring Warp on Silicon Wafers by Automated Non-Contact Scanning
			5540		New Auxiliary Information for Illustration of Flatness and Shape Metrics for Silicon Wafers
		International Epitaxial Wafers Task Force
			5322		Revision to SEMI M61-0307, Specification for Silicon Epitaxial Wafers with Buried Layers
		International Polished Wafers Task Force
			5321		Revision to SEMI M24-0307, Specification for Polished Monocrystalline Silicon Premium Wafers
		International SOI Wafers Task Force
			5541		Revision of SEMI M41-0707, Specification of Silicon-on-Insulator (SOI) for Power Device/ICs
		JA Shipping Box Task Force
			4711		Mechanical Specification for 450 mm Shipping Box Used to Transport and Ship 450 mm Wafers
		Japan AWG Task Force
			TFOF		Japan AWG Task Force
		Japan Test Method Task Force
			TFOF		Japan Test Method Task Force
		Reclaim Wafer Task Force
			TFOF		Reclaim Wafer Task Force
		Test Method Task Force
			4844		Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry
			5029		Revision to SEMI M51-0303, Test Method for Characterizing Silicon Wafers by Gate Oxide Integrity
			5030		Revision to SEMI M60-0306, Test Method for Time Dependent Dielectric Breakdown Characteristics of SiO2 Films for Si Wafer Evaluation
			5389		Revision to MF1982-1110, Test method for analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography
			TFOF		Test Method Task Force
	North America
		International Advanced Surface Inspection Task Force
			5503		Line Item Revision to SEMI M52-0912 Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations (Re: To add M80 in reference)
		International Annealed Si Wafer Task Force
			5583		Revision of SEMI M57-0413, Guide for Specifying Silicon Annealed Wafers
		International Epitaxial Wafers Task Force
			5542		Line Items Revision to SEMI M62-0413, Specifications for Silicon Epitaxial Wafers
		International Polished Wafers Task Force
			5543		Revision to SEMI M1, Specifications for Polished Single Crystal Silicon Wafers
		International Terminology Task Force
			5052		Revision to SEMI M59-1110. Terminology for Silicon Technology
		International Test Methods Task Force
			5313		Line Item Revisions of SEMI MF1535-0707, Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance
			5403		Reapproval of SEMI MF534-0707 Test Method for Bow of Silicon Wafers
			5404		Reapproval of SEMI MF657-0707E Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning
			5558		Revision of SEMI MF928-0305 (Reapproved 0211), Test Methods for Edge Contour of Circular Wafers and Rigid Disk Substrates
		Silicon Wafer Committee
			TFOF		Silicon Wafer Committee
Traceability
	Japan
		5 Year Review TF
			5361		Reapproval of SEMI T17-0706, Specification of Substrate Traceability
			5362		Reapproval of SEMI T18-1106, Specification of Parts and Components Traceability
			TFOF		5 Year Review TF
		Device Security Task Force
			4845		Specification for Organization Identification by Digital Certificate Issued from CSB（Certificate Service Body ） for Anti-Counterfeiting Traceability in Components Supply Chain
			4847		Traceability by Self Authentication Service Body and Authentication Service Body
		Japan PV Traceability Task Force
			5487		New Standards: Specification for Basic Protocols to Support the Interoperation of Traceability Systems Necessary for Managing Product Identity throughout the Life Cycle of Objects Using Digital Signatures and Time Stamps
			5594		New Standard: Guide for Smart Label for PV Traceability
			TFOF		Japan PV Traceability Task Force
		JIG and Unit Package ID Task Force
			5365		Line Item Revision to T15-0705, General Specification of Jig ID: Concept
			5383		Revision to Add a New Subordinate Standard Specification for Reduce Space Marking of Product Packages to SEMI G83-0308, Specification for Bar Code Marking of Product Packages
	North America
		5 Year Review TF
			5581		Reapproval of SEMI T3-0302 (Reapproved 1108), Specification for Wafer Box Labels
			5582		Reapproval of SEMI T4-0301 (Reapproved 0307), Specification for 150 mm and 200 mm Pod Identification Dimensions
			TFOF		5 Year Review TF

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