SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)

Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.

The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.

If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the contact information page.

Blank forms
TFOF (DOC 70K)
SNARF (DOC 68K)

The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.

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Hide details for 3D Packaging and Integration3D Packaging and Integration
Hide details for JapanJapan
Hide details for Fiducial Mark Interoperability Task ForceFiducial Mark Interoperability Task Force
TFOF Fiducial Mark Interoperability Task Force
Hide details for JA 450mm Assembly and Test Die Preparation Task ForceJA 450mm Assembly and Test Die Preparation Task Force
TFOF JA 450mm Assembly and Test Die Preparation Task Force
Hide details for Packaging 5 Year Review Task ForcePackaging 5 Year Review Task Force
5881 Reapproval of SEMI G83-0912: SPECIFICATION FOR BAR CODE MARKING OF PRODUCT PACKAGES
6030 Revision to SEMI G20-96: SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY)
6031 Revision to SEMI G21-0094: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
6093 Revision to SEMI G31-0997: TEST METHOD FOR DETERMINING THE ABRASIVE CHARACTERISTICS OF MOLDING COMPOUNDS
6094 Revision to SEMI G45-93: RECOMMENDED PRACTICE FOR FLASH CHARACTERISTICS OF THERMOSETTING MOLDING COMPOUNDS, with title change to PRACTICE FOR FLASH CHARACTERISTICS OF THERMOSETTING MOLDING COMPOUNDS
6095 Revision to SEMI G49-93: SPECIFICATION FOR PLASTIC MOLDING PREFORMS
6148 Line Item Revision to SEMI G18-96 (Reapproved 0811) “Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” with non-conforming title change to “Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes”
6149 Line Item Revision to SEMI G38-0996 (Reapproved 0811) “Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages”
6150 Line Item Revision to SEMI G56-93 (Reapproved 0811) “Test Method for Measurement of Silver Plating Thickness”
6151 Line Item Revision to SEMI G65-96 (Reapproved 0811) “Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages”
6152 Line Item Revision to SEMI G93-0412: “Measurement Method for Solder Sphere Size for Ball Grid Array Package” with non-conforming title change to “Test Method for Solder Sphere Size for Ball Grid Array Package”
6153 Reapproval of SEMI G90-0811: Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
6154 Line Item Revision to SEMI G10-96 (Reapproved 0811): “Standard Method for Mechanical Measurement of Plastic Package Leadframes” with non-conforming title change to “Test Method for Mechanical Measurement of Plastic Package Leadframes”
6155 Line Item Revision to SEMI G62-95 (Reapproved 0811) “Test Method for Silver Plating Quality”
6156 Line Item Revision to SEMI G70-0996 (Reapproved 0811) “Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes” with non-conforming title change to “Specification for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes”
6157 Reapproval of SEMI G23-0996 (Reapproved 0811): Test Method of Inductance for Internal Traces of Semiconductor Packages
6158 Reapproval of SEMI G42-0996 (Reapproved 0811): Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
6159 Reapproval of SEMI G59-94 (Reapproved 0811): Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
6160 Reapproval of SEMI G60-94 (Reapproved 0811): Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
6161 Reapproval of SEMI G66-96 (Reapproved 0811): Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds
6162 Reapproval of SEMI G67-0996 (Reapproved 0811): Test Method for the Measurement of Particle Generation from Sheet Materials
6163 Reapproval of SEMI G68-0996 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages
6164 Reapproval of SEMI G69-0996 (Reapproved 0811): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
6165 Reapproval of SEMI G71-0996 (Reapproved 0811): Specification for Barcode Marking of Intermediate Containers for Packaging Materials
6166 Reapproval of SEMI G89-0211: Specification for Leadframe Strip Size
6167 Line Item Revision to SEMI G73-0997 (Reapproved 0811) “Test Method for Pull Strength for Wire Bonding”
6223 Revision to SEMI G4-0302 (Reapproved 0811): Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
6224 Revision to SEMI G11-88 (Reapproved 0811): “Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds” with non-conforming title change to “Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds”
6225 Revision to SEMI G13-88 (Reapproved 0811): “Standard Test Method for Expansion Characteristics of Molding Compounds” with non-conforming title change to “Test Method for Expansion Characteristics of Molding Compounds”
6226 Revision to SEMI G15-93 (Reapproved 0811): “Standard Test Method for Differential Scanning Calorimetry of Molding Compounds” with non-conforming title change to “Test Method for Differential Scanning Calorimetry of Molding Compounds”
6227 Revision to SEMI G24-89 (Reapproved 0811): Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
6228 Revision to SEMI G25-89 (Reapproved 0811): Test Method for Measuring the Resistance of Package Leads
6229 Revision to SEMI G28-0997 (Reapproved 0811): Specification for Leadframes for Plastic Molded S.O. Packages
6230 Revision to SEMI G43-87 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
6231 Revision to SEMI G51-90 (Reapproved 0811): Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes
6232 Revision to SEMI G55-93 (Reapproved 0811): Test Method for Measurement of Silver Plating Brightness
6233 Line Item Revision to SEMI G29-1296E (Reapproved 0811): Test Method for Trace Contaminants in Molding Compounds
TFOF Packaging 5 Year Review Task Force
Hide details for Thin Chip Handling Task ForceThin Chip Handling Task Force
5836 New Standard: Test Method for Adhesive Strength for Adhesive Tray Used for Thin Chip Handling
TFOF Thin Chip Handling Task Force
Hide details for North AmericaNorth America
Hide details for 3DP&I Bonded Wafer Stacks Task Force3DP&I Bonded Wafer Stacks Task Force
5173 New Standard, Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack
6075 New Standard, Guide for Describing Glass-Based Material for Use in 3DS-IC Process
6076 New Standard, Specification for Identification and Marking on Wafers and Wafer Stacks for 3DS-IC Applications
TFOF 3DP&I Bonded Wafer Stacks Task Force
Hide details for 3DP&I Inspection and Metrology Task Force3DP&I Inspection and Metrology Task Force
5976 New Standard, Terminology for 3DS-IC Technology
6175 New Standard, Guide on Measurements of Openings and Vias in Glass
TFOF 3DP&I Inspection and Metrology Task Force
Hide details for Fan-Out Panel Level Packaging (FO-PLP) Panel Task ForceFan-Out Panel Level Packaging (FO-PLP) Panel Task Force
TFOF Fan-Out Panel Level Packaging (FO-PLP) Panel Task Force
Hide details for TaiwanTaiwan
Hide details for 3DP&I Middle-End Process Task Force3DP&I Middle-End Process Task Force
5800 New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process
TFOF 3DP&I Middle-End Process Task Force
Hide details for 3DP&I Testing Task Force3DP&I Testing Task Force
TFOF 3DP&I Testing Task Force
Hide details for Automated Test EquipmentAutomated Test Equipment
Hide details for North AmericaNorth America
Hide details for NA ATE 5-Year ReviewNA ATE 5-Year Review
TFOF NA ATE 5-Year Review
Hide details for Standard Test Data Format (STDF) Task ForceStandard Test Data Format (STDF) Task Force
TFOF Standard Test Data Format (STDF) Task Force
Hide details for Test Cell CommunicationsTest Cell Communications
TFOF Test Cell Communications
Hide details for Automation TechnologyAutomation Technology
Hide details for EuropeEurope
Hide details for Equipment Interface Specification (EIS) Equipment Interface Specification (EIS)
5151 New Standard: Specification To Transfer Wafer Mark Reader Data To Host System (MES)
5154 New Subordinate Standard "Profibus implementation specification for a Horizontal Communication between equipment for crystalline photovoltaic fabrication system" (Parent Document: 4804 "SPECIFICATION FOR A HORIZONTAL COMMUNICATION BETWEEN EQUIPMENT FOR PHOTOVOLTAIC FABRICATION SYSTEM")
5339 Specification for Single Material Tracking and Tracing For Crystalline Silicon PV
5566 Line Item Revision to SEMI PV002-00-0709E Guide for PV Equipment Communication Interfaces (PVECI), modify requirement [PV02-RQ-00007-00] to allow implementation of new namelist requests instead of required documentation.
TFOF Equipment Interface Specification (EIS)
Hide details for PV Wafer Traceability Task Force PV Wafer Traceability Task Force
TFOF PV Wafer Traceability Task Force
Hide details for GlobalGlobal
Hide details for Equipment Interface Specification (EIS)Equipment Interface Specification (EIS)
TFOF Equipment Interface Specification (EIS)
Hide details for JapanJapan
Hide details for Flow Oriented Manufacturing Line Operation System (FOMLOS) Flow Oriented Manufacturing Line Operation System (FOMLOS)
6285 Line Item Revision to SEMI A1-0617: Specification for Horizontal Communication (HC) between Equipment for Factory Automation System, including its subordinate document SEMI A1.1-0617
TFOF Flow Oriented Manufacturing Line Operation System (FOMLOS)
Hide details for TaiwanTaiwan
Hide details for Printed Circuit Board Equipment Communication Interface (PCBECI) Task ForcePrinted Circuit Board Equipment Communication Interface (PCBECI) Task Force
6263 New Standard: SPECIFICATION FOR PRINTED CIRCUIT BOARD EQUIPMENT COMMUNICATION INTERFACES (PCBECI)
TFOF Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force
Hide details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Hide details for EuropeEurope
Hide details for Contactless capacitive resistivity measurement of semi-insulating semiconductorsContactless capacitive resistivity measurement of semi-insulating semiconductors
TFOF Contactless capacitive resistivity measurement of semi-insulating semiconductors
Hide details for EU Compound Semiconductor Materials CommitteeEU Compound Semiconductor Materials Committee
TFOF EU Compound Semiconductor Materials Committee
Hide details for M54 RevisionM54 Revision
6118 Revision of SEMI M54-0304 (Reapproved 0611) - Guide for Semi-Insulating (SI) GaAs Material Parameters
TFOF M54 Revision
Hide details for SiC Material and Wafer Specification TFSiC Material and Wafer Specification TF
6015 Line Item Revision SEMI M81-0611 - Guide to Defects Found in Monocrystalline Silicon Carbide Substrates (5 year review)
TFOF SiC Material and Wafer Specification TF
Hide details for North AmericaNorth America
Hide details for Gallium Nitride (GaN) Task ForceGallium Nitride (GaN) Task Force
TFOF Gallium Nitride (GaN) Task Force
Hide details for NA Compound Semiconductor Materials Committee 5-Year Review TFNA Compound Semiconductor Materials Committee 5-Year Review TF
6132 Line Item Revision of SEMI M79-0211 Specification for Round 100 mm Polished Monocrystalline Germanium Wafers for Solar Cell Applications
6133 Line Item Revision of SEMI M10-0816 TERMINOLOGY FOR IDENTIFICATION OF STRUCTURES AND FEATURES SEEN ON GALLIUM ARSENIDE WAFERS
6134 Reapproval of
SEMI M23-0811 — SPECIFICATION FOR POLISHED MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS
SEMI M23.1-0211 — STANDARD FOR ROUND 50 MM DIAMETER POLISHED MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS
SEMI M23.2-0211 — STANDARD FOR ROUND 3 INCH (76.2 MM) DIAMETER POLISHED MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS
SEMI M23.4-0211 — SPECIFICATION FOR ROUND 100 MM POLISHED MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS FOR ELECTRONIC AND OPTOELECTRONIC DEVICE APPLICATIONS (DOVE-TAIL TYPE)
SEMI M23.5-0211 — SPECIFICATION FOR ROUND 100 MM POLISHED MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS FOR ELECTRONIC AND OPTOELECTRONIC DEVICE APPLICATIONS (V-GROOVE OPTION)
SEMI M23.6-0211 — SPECIFICATION FOR ROUND 150 MM POLISHED MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS (NOTCHED)
TFOF NA Compound Semiconductor Materials Committee 5-Year Review TF
Hide details for Silicon Carbide Task ForceSilicon Carbide Task Force
TFOF Silicon Carbide Task Force
Hide details for EH&SEH&S
Hide details for JapanJapan
Hide details for GHG Emission Characterization Task ForceGHG Emission Characterization Task Force
TFOF GHG Emission Characterization Task Force
Hide details for Japan Environmental Health and Safety CommitteeJapan Environmental Health and Safety Committee
TFOF Japan Environmental Health and Safety Committee
Hide details for S18 Revision Task ForceS18 Revision Task Force
6198 Line Item Revision for SEMI S18 Environmental, Health and Safety Guideline for Flammable Silicon Compounds
6289 Revision to SEMI S18-0312: ENVIRONMENTAL, HEALTH AND SAFETY GUIDELINE FOR FLAMMABLE SILICON COMPOUNDS
TFOF S18 Revision Task Force
Hide details for SDRCM(S Documents REG-PG-SM Conformance Maintenance) TFSDRCM(S Documents REG-PG-SM Conformance Maintenance) TF
6199 Reapproval of SEMI S17-0113, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use With Manufacturing Equipment
6288 Line Item Revision to SEMI S21-1106E (Reapproved 0612): Safety Guideline for Worker Protection
TFOF SDRCM(S Documents REG-PG-SM Conformance Maintenance) TF
Hide details for Seismic Protection Task ForceSeismic Protection Task Force
TFOF Seismic Protection Task Force
Hide details for Japan and North AmericaJapan and North America
Hide details for S23 Revision Global Task ForceS23 Revision Global Task Force
TFOF S23 Revision Global Task Force
Hide details for North AmericaNorth America
Hide details for Anchorage Task ForceAnchorage Task Force
TFOF Anchorage Task Force
Hide details for Control of Hazardous Energy (CoHE) Task ForceControl of Hazardous Energy (CoHE) Task Force
5957 Line Item Revision of S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. ( Re: Control of Hazardous Energy)
TFOF Control of Hazardous Energy (CoHE) Task Force
Hide details for Energetic Materials EHS Task ForceEnergetic Materials EHS Task Force
5761 New Standard: EHS Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes
TFOF Energetic Materials EHS Task Force
Hide details for Ergonomics Task ForceErgonomics Task Force
5917 Line Item Revisions to SEMI S8, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment. Addition of reference to a manual material-handling guide in SEMI-S8, Appendix 2, Lifting, Strength, and Materials Handling
5996 Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
6309 Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment
TFOF Ergonomics Task Force
Hide details for Fire Protection Task ForceFire Protection Task Force
5969 Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (pertaining to Fire)
5970 Line Item Revisions to SEMI S14, Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment (pertaining to alignment with SEMI S10 )
6172 Line item revision to SEMI S14-1016: Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment to correct nonconforming title
TFOF Fire Protection Task Force
Hide details for Lifting Equipment Task ForceLifting Equipment Task Force
TFOF Lifting Equipment Task Force
Hide details for Manufacturing Equipment Safety SubcommitteeManufacturing Equipment Safety Subcommittee
TFOF Manufacturing Equipment Safety Subcommittee
Hide details for NA Environmental Health and Safety CommitteeNA Environmental Health and Safety Committee
6098 Reapproval of S3,Safety Guideline for Process Liquid Heating Systems
TFOF NA Environmental Health and Safety Committee
Hide details for S10 Task ForceS10 Task Force
6049 Line-Item Revision to SEMI S10-0815E Safety Guideline for Risk Assessment and Risk Evaluation Process
TFOF S10 Task Force
Hide details for S2 Chemical Exposure Task ForceS2 Chemical Exposure Task Force
5624 Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Changes related to representative sampling
6171 Line Item revision for chemical exposure improvements to SEMI S2
TFOF S2 Chemical Exposure Task Force
Hide details for S2 Interlock and Safety Control Systems Reliability SelectionS2 Interlock and Safety Control Systems Reliability Selection
TFOF S2 Interlock and Safety Control Systems Reliability Selection
Hide details for S2 Ladders & Steps Task ForceS2 Ladders & Steps Task Force
TFOF S2 Ladders & Steps Task Force
Hide details for S2 Non-Ionizing Radiation Task ForceS2 Non-Ionizing Radiation Task Force
TFOF S2 Non-Ionizing Radiation Task Force
Hide details for S22 Task ForceS22 Task Force
6099 Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment
TFOF S22 Task Force
Hide details for S28 Revision Task ForceS28 Revision Task Force
6208 Line Item Revision to SEMI S28-1011 - Safety Guideline for Robots and Load Ports Intended for Use in Semiconductor Manufacturing Equipment
6310 Reapproval of SEMI S28-1011 Safety Guideline for Robots and Load Ports Intended for Use in Semiconductor Manufacturing Equipment
TFOF S28 Revision Task Force
Hide details for S3 Revision Task ForceS3 Revision Task Force
6209 Revision of S3 with title change, Safety Guideline for Process Liquid Heating Systems
TFOF S3 Revision Task Force
Hide details for S6 Revision Task ForceS6 Revision Task Force
4975 Revision to SEMI S6, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment (Line item revisions for addressing gas detectors and other concerns)
5681 Line Item Revisions to SEMI S6, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment
6204 Line Item Revisions to SEMI S6, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment
TFOF S6 Revision Task Force
Hide details for Seismic Liaison Task ForceSeismic Liaison Task Force
TFOF Seismic Liaison Task Force
Hide details for TaiwanTaiwan
Hide details for Equipment Safety Task ForceEquipment Safety Task Force
TFOF Equipment Safety Task Force
Hide details for Seismic Task ForceSeismic Task Force
TFOF Seismic Task Force
Hide details for FacilitiesFacilities
Hide details for JapanJapan
Hide details for 5-year-review TF5-year-review TF
TFOF 5-year-review TF
Hide details for F1 Revision TFF1 Revision TF
TFOF F1 Revision TF
Hide details for Gas Box Components Joint Task ForceGas Box Components Joint Task Force
TFOF Gas Box Components Joint Task Force
Hide details for Japan Gases and Facilities CommitteeJapan Gases and Facilities Committee
TFOF Japan Gases and Facilities Committee
Hide details for KoreaKorea
Hide details for Equipment Cleanness Task Force Equipment Cleanness Task Force
4922 New Standard: Guide for Equipment Fan Filter Unit (EFFU) Performance
TFOF Equipment Cleanness Task Force
Hide details for North AmericaNorth America
Hide details for Building Information Modeling (BIM) for Semiconductor Capital Equipment Task ForceBuilding Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
5155 New Standard: Guide for Facilities Data Package for Semiconductor Equipment Installation
TFOF Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
Hide details for NA Facilities CommitteeNA Facilities Committee
6210 Reapproval of SEMI E51-0200, Guide for Typical Facilities Services and Termination Matrix
TFOF NA Facilities Committee
Hide details for Power Grid Harmonics Task ForcePower Grid Harmonics Task Force
6037 New Standard: Specification for Power Grid Harmonics Compatibility
6313 Reapproval of SEMI F47-0706 (Reapproved 0812), Specification for Semiconductor Processing Equipment Voltage Sag Immunity
TFOF Power Grid Harmonics Task Force
Hide details for SEMI F51 Revision Task ForceSEMI F51 Revision Task Force
TFOF SEMI F51 Revision Task Force
Hide details for Flat Panel Display (FPD) - Materials & ComponentsFlat Panel Display (FPD) - Materials & Components
Hide details for JapanJapan
Hide details for Flexible Display Task ForceFlexible Display Task Force
5977 New Standard, Test Method for Water Vapor Barrier Property for Plastic Films with High Barrier for Electronic Devices
TFOF Flexible Display Task Force
Hide details for FPD Color Filter Task ForceFPD Color Filter Task Force
6102 Line Item Revision to SEMI D22-1109, Test Method for the Determination of Color, Transmittance of FPD Color Filter Assemblies
6103 Line Item Revision to SEMI D63-0811, “Measurement Method for Depolarization Effect of FPD Color Filter” with non-conforming title change to: “Test Method for Depolarization Effect of. FPD Color Filter”
TFOF FPD Color Filter Task Force
Hide details for FPD Mask Task ForceFPD Mask Task Force
TFOF FPD Mask Task Force
Hide details for Japan FPD Materials and Components CommitteeJapan FPD Materials and Components Committee
TFOF Japan FPD Materials and Components Committee
Hide details for Polarizing Film TFPolarizing Film TF
6006 New Standard: Test method for measurements of dimension of films for FPD – contour
matching method
6014 Revision to SEMI D60-0710: Test Method of Surface Scratch Resistance for FPD Polarizing Film and Its Materials, with title change to: Test Method of Surface Scratch Resistance for FPD Polarizing Film and Cover Plastics for Mobile Displays
TFOF Polarizing Film TF
Hide details for Flat Panel Display (FPD) - MetrologyFlat Panel Display (FPD) - Metrology
Hide details for JapanJapan
Hide details for D31 Revision Task ForceD31 Revision Task Force
6101 Line Item Revision of SEMI D31-0914, Definition of Measurement Index (DSEMU) for Luminance Mura in FPD Image Quality Inspection, with title change to: Guide for Definition of Measurement Index (DSEMU) for Luminance Mura in FPD Image Quality Inspection.
TFOF D31 Revision Task Force
Hide details for KoreaKorea
Hide details for Perceptual Image QualityPerceptual Image Quality
TFOF Perceptual Image Quality
Hide details for Perceptual Viewing AnglePerceptual Viewing Angle
5633 New Standard, Test Method for Viewing Angle Characteristic using Mixed Color on Visual Displays
TFOF Perceptual Viewing Angle
Hide details for Transparent DisplayTransparent Display
6222 New Standard, Test Method for Clarity Characteristic of Transparent Display
TFOF Transparent Display
Hide details for TaiwanTaiwan
Hide details for Flexible Displays Task ForceFlexible Displays Task Force
5948 New Standard: Guide for Mechanical Stress Test Methods in the Measurement of Gas Barrier Performance for Flexible Display Components and Devices under a Normal Usage Condition
5949 New Standard: Test Method of Flicker Measurement for Flexible Displays
6104 New Standard: Practice for Calibrating Automated Optical Inspection System in Front-of-View Foldable OLED Display Devices
TFOF Flexible Displays Task Force
Hide details for Transparent DisplayTransparent Display
6201 New Standard: Guide for Tone Reproduction Curves for Transparent Displays
TFOF Transparent Display
Hide details for Transparent Display Task ForceTransparent Display Task Force
6302 Reapproval of SEMI D56-0310, MEASUREMENT METHOD FOR AMBIENT CONTRAST OF LIQUID CRYSTAL DISPLAYS
6303 Reapproval of SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection
6304 Reapproval of SEMI D58-0310, Terminology for Color Breakup in Liquid Crystal Displays
6305 Reapproval of SEMI D59-0710, 3D Display Terminology
6306 Reapproval of SEMI D62-0611, Measurement Method of LED Light Bar for Liquid Crystal Displays
6307 Reapproval of SEMI D65-1011, Measurement Method for the Color Breakup of Field Sequential Color Display
6308 Reapproval of SEMI D68-0512, Test Methods for Optical Properties of Electronic Paper Displays
Hide details for GasesGases
Hide details for EuropeEurope
Hide details for Cleaning GasesCleaning Gases
6148 Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing
TFOF Cleaning Gases
Hide details for Gases EU CommitteeGases EU Committee
6217 Reapproval of SEMI C3.56-0312, Specification for Diborane Mixtures
6218 Reapproval of SEMI C3.57-0312, Specification for Carbon Dioxide, CO2, Electronic Grade in Cylinders
6219 Reapproval of SEMI C52-0301 (Reapproved 0312), Specification for the Shelf Life of a Specialty Gas
Hide details for Permeation Tubes for Trace Moisture CalibrationPermeation Tubes for Trace Moisture Calibration
TFOF Permeation Tubes for Trace Moisture Calibration
Hide details for JapanJapan
Hide details for Live Gas Flow Rate Task ForceLive Gas Flow Rate Task Force
TFOF Live Gas Flow Rate Task Force
Hide details for North AmericaNorth America
Hide details for Filters and Purifiers Task ForceFilters and Purifiers Task Force
6212 Reapproval of SEMI F38-0699 (Reapproved 0611), Test Method for Efficiency Qualification of Point-of-Use Gas Filters
6290 New Standard, Test Method for the Determination of Hydrocarbons Present on Wetted Surfaces of Ultra High Purity Gas Delivery Components and Plumbing Systems
6291 New Standard, Test Method for the Determination of Metallic Elements Present on Wetted Surfaces of Ultra High Purity Gas Delivery Components and Plumbing Systems
TFOF Filters and Purifiers Task Force
Hide details for Gases Specification Task ForceGases Specification Task Force
6125 Revision to SEMI F23-0697 (Reapproved 0712), Particle Specification for Grade 10/0.2 Flammable Specialty Gases with title change to Specification for Particle Concentration of Grade 10/0.2 Hydrogen Gas
TFOF Gases Specification Task Force
Hide details for Heater Jacket Task ForceHeater Jacket Task Force
6312 Reapproval of SEMI F109-0212, Guide for Heater Systems Requirements
TFOF Heater Jacket Task Force
Hide details for Mass Flow Controller Task ForceMass Flow Controller Task Force
6214 Reapproval of SEMI F53-0600 (Reapproved 0412), Test Method for Evaluating the Electromagnetic Susceptibility of Thermal Mass Flow Controllers
6215 Reapproval of SEMI F55-0600 (Reapproved 0412), Test Method for Determining the Corrosion Resistance of Mass Flow Controllers
6216 Reapproval of SEMI F56-0600 (Reapproved 0412), Test Method for Determining Steady-State Supply Voltage Effects for Mass Flow Controllers
TFOF Mass Flow Controller Task Force
Hide details for Materials of Construction of Gas Delivery Systems Task ForceMaterials of Construction of Gas Delivery Systems Task Force
6106 Reapproval of SEMI F13-1101, Guide for Gas Source Control Equipment
6107 Reapproval of SEMI F14-93 (Reapproved 0699), Guide for the Design of Gas Source Equipment Enclosures
6109 Reapproval of SEMI F32-0211, Test Method for Determining of Flow Coefficient for High Purity Shutoff Valves
6110 Reapproval of SEMI F4-0211, Specification for Pneumatically Actuated Cylinder Valves
6111 Reapproval of SEMI F6-92, Guide for Secondary Containment of Hazardous Gas Piping Systems
6211 Reapproval of SEMI F22-0812, Guide for Bulk and Specialty Gas Distribution Systems
6213 Reapproval of SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems
TFOF Materials of Construction of Gas Delivery Systems Task Force
Hide details for Pressure Measurement Task ForcePressure Measurement Task Force
TFOF Pressure Measurement Task Force
Hide details for Surface Mount Sandwich Component Dimensions Task ForceSurface Mount Sandwich Component Dimensions Task Force
TFOF Surface Mount Sandwich Component Dimensions Task Force
Hide details for HB-LEDHB-LED
Hide details for ChinaChina
Hide details for GaN based LED Epitaxial Wafer Task ForceGaN based LED Epitaxial Wafer Task Force
5776 New Standard: Test Method for Detecting Surface Defects of GaN based LED Epitaxial Wafer Used for Manufacturing HB-LED
TFOF GaN based LED Epitaxial Wafer Task Force
Hide details for Patterned Sapphire Substrate Task ForcePatterned Sapphire Substrate Task Force
6192 New Standard: Specification for Dry Etching Patterned Sapphire Substrate (DPSS)
TFOF Patterned Sapphire Substrate Task Force
Hide details for Sapphire Single Crystal Ingot Task ForceSapphire Single Crystal Ingot Task Force
5775 New Standard: Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers
TFOF Sapphire Single Crystal Ingot Task Force
Hide details for Sapphire Single Crystal Orientation Task Force Sapphire Single Crystal Orientation Task Force
TFOF Sapphire Single Crystal Orientation Task Force
Hide details for Single Crystal Sapphire Task ForceSingle Crystal Sapphire Task Force
5629 New Standard, Guide for Identification Defects on Bare Surfaces of Sapphire Wafers
5723 New Standard: Specification for Single Crystal Sapphire Intended for Use for Manufacturing HB- LED Wafers
5946 New Standard: Test Method for Grain Boundary of Single Crystal Sapphire by Optical Homogeneity Technique (OHT)
TFOF Single Crystal Sapphire Task Force
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Hide details for HB-LED AssemblyHB-LED Assembly
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TFOF HB-LED Equipment Communication Interfaces TF
Hide details for HB-LED Source Materials TFHB-LED Source Materials TF
5984 New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing
5985 New Standard: Guide for Triethylgallium for HB-LED Manufacturing
5986 New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing
5987 New Standard: Guide for Trimethylgallium for HB-LED Manufacturing
5988 New Standard: Guide for Trimethylindium for HB-LED Manufacturing
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6300 New Standard: Guide for EDA Freeze Version
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6089 Line Item Revision to "SEMI E170.1-0416: SPECIFICATION FOR SECS-II PROTOCOL FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM”, “SEMI E170-0416: SPECIFICATION FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM (SFORMS)” and "SEMI E5-0813: SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT (SECS-II)” with title change
6091 Line Item Revision to SEMI E174-1116: SPECIFICATION FOR WAFER JOB MANAGEMENT (WJM)
6092 New Standard: Specification for Centralized User Authentication and Role Authorization Management (CUARAM)
6189 Line Item Revision to SEMI E170-mmyy: SPECIFICATION FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM (SFORMS), SEMI E170.1-mmyy: SPECIFICATION FOR SECS-II PROTOCOL FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM and SEMI E5-mmyy: SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT (SECS-II)
6202 Revision to SEMI E174-mmyy (SEMI Doc. 6091): Specification for Wafer Job Management (WJM)
6287 Line Item Revision to E87-0312: Specification for Carrier Management (CMS)
TFOF GEM 300 Task Force
Hide details for JA I&CC Maintenance Task ForceJA I&CC Maintenance Task Force
6090 Line Item Revision to SEMI E91-0600 (Reapproved 1109), SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL (PSEM)
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Hide details for Advanced Back-end Factory Integration TFAdvanced Back-end Factory Integration TF
6301 Line Item Revision to E142-0211(Reapproved 1016) Specification for Substrate Mapping: Adding packaging raw materials traceability method
TFOF Advanced Back-end Factory Integration TF
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4946 Line Item Revision to SEMI E87-1017, Specification for Carrier Management (CMS) and E87.1-1017, Specification for SECS-II Protocol for Carrier Mnagement (CMS), Adding Carrier Ready to Unload Prediction Feature
5832 New Standard, Specification for Equipment Generic Counter Model (GCM)
TFOF GEM 300 Task Force
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6008 New Auxiliary Information: Equipment Data Acquisition (EDA) Freeze Version Overview
6009 Line Item Revision to Specifications E132, E132.1
6064 Line Item Revision to SEMI E121-0305, Guide for Style and Usage of XML for Semiconductor Manufacturing Applications
TFOF Diagnostic Data Acquisition Task Force NA
Hide details for Energy Saving Equipment Communication Task ForceEnergy Saving Equipment Communication Task Force
TFOF Energy Saving Equipment Communication Task Force
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5913 Reapproval of SEMI E157-0611, Specification for Module Process Tracking
5966 Line Item Revision to E90 (SPECIFICATION FOR SUBSTRATE TRACKING),
E90.1 (SPECIFICATION FOR SECS-II PROTOCOL SUBSTRATE TRACKING)
6005 Line Item Revision to SEMI E30 Generic Model for Communications and Control of Manufacturing Equipment (GEM)
6114 Line Item Revision to SEMI E5-0813, SEMI Equipment Communications Standard 2 Message Content (SECS-II)
6185 Line-item Revision to SEMI E4-0699 (Reapproved 0612), SEMI Equipment Communications Standard 1 Message Transfer (SECS-I) to correct nonconforming title to: Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
6234 Line-item Revision to SEMI E37-0413, High-Speed SECS Message Services (HSMS) Generic Services, to correct nonconforming title
6235 Line-item Revision to SEMI E37.1-0702 (Reapproved 0413), High-Speed SECS Message Services Single Selected-Session Mode (HSMS-SS), to correct nonconforming title
6236 Line-item Revision to SEMI E172-1015, Specification for SECS Equipment Data Dictionary (SEDD), to address editorial changes in complementary file
6237 Reapproval of SEMI E116.1-0707, Specification for SECS-II Protocol for Equipment Performance Tracking (EPT)
6239 Reapproval of SEMI E130.1, Specification for SECS-II Protocol for Prober Specific Equipment Model for 300 mm Environment (PSEM300)
TFOF GEM 300 Task Force
Hide details for Graphical User Interfaces (GUI) Task ForceGraphical User Interfaces (GUI) Task Force
6124 Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor Manufacturing Equipment
TFOF Graphical User Interfaces (GUI) Task Force
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6238 Reapproval of SEMI E126-0708 (Reapproved 0613), Specification for Equipment Quality Information Parameters (EQIP)
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6174 Line Item Revision to SEMI E54.9, Specification for Sensor/Actuator Network Communication Specification for Modbus/TCP over TCP/IP
6240 Reapproval of SEMI E54.23-0513, Specification for Sensor/Actuator Network Communications for CC-Link IE Field Network
TFOF Sensor Bus Task Force
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Hide details for Backend Factory Integration Task ForceBackend Factory Integration Task Force
6147 New Standard: Specification of Backend Die Traceability
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Hide details for EU Gases and Liquid Chemicals CommitteeEU Gases and Liquid Chemicals Committee
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6256 Reapproval of SEMI C81-0113, Guide for Tris(Dimethylamino) Silane (3DMAS)
TFOF Precursor Specifications Task Force
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6196 Reapproval of SEMI C77-0912, Test Method for Determining the Counting Efficiency of Liquid-Borne Particle Counters for Which the Minimum Detectable Particle Size is Between 30 nm and 100 nm
TFOF Liquid-Borne Particle Counter Task Force
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6197 Reapproval of SEMI F110-0712, Test Method for Mono-Dispersed Polystyrene Latex (PSL) Challenge of Liquid Filters
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TFOF Welding Fitting Task Force
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5991 New Standard: Test Method for Determining Density of Chemical Mechanical Polish (CMP) Slurries
6190 Line-item Revision to SEMI C45-0309E, Specification and Guideline for Tetraethylorthosilicate (TEOS) with title change to: Specification and Guide for Tetraethylorthosilicate (TEOS)
6250 Line-item Revision to SEMI C29-1110, Specifications and Guide for 4.9% Hydrofluoric Acid (10:1 v/v) to correct nonconforming title: Specification and Guide for 4.9% Hydrofluoric Acid (10:1 v/v)
6252 Reapproval of SEMI C1-0310, Guide for the Analysis of Liquid Chemicals
6253 Reapproval of SEMI C40-1110, Specification for Potassium Hydroxide, 45% Solution
6254 Reapproval of SEMI C62-0309, Specification for Porogen Precursors Used in Low K CVD Processes
6255 Reapproval of SEMI C63-1108, Specification for Organosilicate Precursors Used in Low K CVD Processes
6257 Reinstatement of SEMI F34-0998, Guide for Liquid Chemical Pipe Labeling
6259 Revision To SEMI C21-0708, Specifications and Guidelines For Ammonium Hydroxide Including Title Change To "Specification and Guide For Ammonium Hydroxide
6260 Revision to SEMI C28-0611,Specifications for Hydrofluoric Acid, with title change to correct nonconforming title.
6261 Revision to SEMI C41-0705, Specifications and Guidelines for 2-Propanol, including title change to "Specification and Guide For 2-Propanol"
6262 Revision to SEMI C44-0514, Specification And Guide For Sulfuric Acid
TFOF Chemical Analytical Methods Task Force
Hide details for High Purity Liquid Assemblies & SystemsHigh Purity Liquid Assemblies & Systems
5942 Revision to SEMI E49.4-0298, Guide for High Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment, with title change to, Guide for Ultrahigh Purity Solvent Distribution Systems with Metallic Fluid Paths in Semiconductor Manufacturing Equipment
5978 Revision to SEMI E49.5-1104, Guide for Ultrahigh Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment, with title change to, Guide for the Design of Ultrahigh Purity Solvent Distribution Systems with Non-Metallic Fluid Paths in Semiconductor Manufacturing Equipment
6258 Revision to SEMI E49.7-0304E, Purity Guide for the Design And Manufacture of Ultrapure Water and Liquid Chemical Systems In Semiconductor Process Equipment
TFOF High Purity Liquid Assemblies & Systems
Hide details for High Purity Polymer Materials and Components Task ForceHigh Purity Polymer Materials and Components Task Force
6085 Revision to SEMI F57- 0314, SPECIFICATION FOR HIGH PURITY POLYMER MATERIALS AND COMPONENTS USED IN ULTRAPURE WATER AND LIQUID CHEMICAL DISTRIBUTION SYSTEMS.
6195 Revision to SEMI F104-0312, Particle Test Method for Evaluation of Components Used in Ultrapure Water and Liquid Chemical Distribution Systems, with title change to correct nonconforming title.
TFOF High Purity Polymer Materials and Components Task Force
Hide details for Ultra Pure Water Task ForceUltra Pure Water Task Force
6136 Revision to SEMI F98-0305 (Reapproved 1111), Guide for Treatment of Reuse Water in Semiconductor Processing
TFOF Ultra Pure Water Task Force
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Hide details for MEMS Material CharacterizationMEMS Material Characterization
6007 New Standard: Specification for a Test Pattern for Deep Reactive Ion Etching (DRIE) Process Characterization
TFOF MEMS Material Characterization
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5267 New Standard, Specification for Microfluidic Port and Pitch Dimensions
TFOF MEMS Microfluidics
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Hide details for MEMS ReliabilityMEMS Reliability
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Hide details for MEMS Substrate TFMEMS Substrate TF
6018 New Standard: Specification for Silicon Substrates used in fabrication of MEMS Devices
TFOF MEMS Substrate TF
Hide details for NA MEMS / NEMS Committee for 5-Year ReviewNA MEMS / NEMS Committee for 5-Year Review
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Hide details for Cycle Time Metrics Task ForceCycle Time Metrics Task Force
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Hide details for Equipment Cost of Ownership TFEquipment Cost of Ownership TF
6144 Line-item Revision to SEMI E140-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems
6145 Line-item Revisions to SEMI E35-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment
6146 Line-item Revisions to SEMI E35-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment and SEMI E140-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems
TFOF Equipment Cost of Ownership TF
Hide details for Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task ForceEquipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
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Hide details for RF MeasurementsRF Measurements
6184 Revision to SEMI E135, Test Method for RF Generators to Determine Transient Response
6241 Reapproval of SEMI E113-306 (Reapproved 0512), Specification for Semiconductor Processing Equipment RF Power Delivery Systems
6242 Reapproval of SEMI E136-1104 (Reapproved 0512), Test Method for Determining the Output Power of RF Generators Used in Semiconductor Processing Equipment RF Power Delivery Systems
6243 Reapproval of SEMI E143-0306 (Reapproved 0512), Test Method for Measuring Power and Variation into a 50-Ω Load and Power Variation and Spectrum into a Load with a VSWR of 2.0 at Any Phase Angle
TFOF RF Measurements
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Hide details for NA Microlithography Committee for 5-Year ReviewNA Microlithography Committee for 5-Year Review
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6220 Line Item revision to SEMI P19-92 (Reapproved 0707)
SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE
6221 Revision to SEMI P18-92 (Reapproved 1104)
SPECIFICATION FOR OVERLAY CAPABILITIES OF WAFER STEPPERS
TFOF Patterning Metrology Task Force
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Hide details for Crystalline Silicon Solar Cell Task ForceCrystalline Silicon Solar Cell Task Force
5842 New Standard: Test Method for Metal-Wrap-Through Solar Cell Via Resistance
6074 New Standard: Test Method for Peeling Force between Electrode and Ribbon/Back Sheet
6112 New Standard: Specification for Voltage Sweep Time and Direction in Transient Mode I-V Measurement of Silicon Solar Cells
TFOF Crystalline Silicon Solar Cell Task Force
Hide details for Multi-wire Saws Task ForceMulti-wire Saws Task Force
TFOF Multi-wire Saws Task Force
Hide details for PV Diffusion Furnace Test Methods TF PV Diffusion Furnace Test Methods TF
5841 New Standard: Guide for Specifying Low Pressure Horizontal Diffusion Furnace
5983 New Standard: Test Method for In-line Sheet Resistance Inspection
TFOF PV Diffusion Furnace Test Methods TF
Hide details for PV Module Task ForcePV Module Task Force
5661 New Standard: Test Method for Electrical Parameters of Bifacial Solar Module
5725 New Standard: Practice for Metal Wrap Through (MWT) Back Contact PV Module Assembly
5925 New Standard: Specification for Dual-glass Module with Crystalline Silicon Terrestrial Solar Cell
5968 New Standard: Guide for Sample Preparation Method for Photovoltaic Backsheet Performance Tests
5982 New Standard: Specification for Crystalline Silicon Photovoltaic Module Dimensions
6069 New Standard: Specification for Structural Silicone Adhesive for the Back Rail Fixture on PV Modules
6070 New Standard: Test Method for Cell Defects in Crystalline Silicon PV Modules by Electroluminescence (EL) Imaging
6073 New Standard: Specification for Crystalline Silicon PV Modules with Integrated Power Optimizer
6113 New Standard: Test Method for Abrasion Resistance of the Polymer Backsheet of Crystalline Silicon Solar Modules
6294 Reapproval of SEMI PV47-0513, Specification for Anti-Reflective Coated Glass, Used in Crystalline Silicon Photovoltaic Modules
TFOF PV Module Task Force
Hide details for Testing Equipment Task ForceTesting Equipment Task Force
6191 New Standard: Guide for the Design of Testing and Sorting Equipment for Crystalline Silicon Solar Cells
TFOF Testing Equipment Task Force
Hide details for Thin Film PV Module Task ForceThin Film PV Module Task Force
6295 New Standard: Test Method for Extension of Flexible Thin Film PV Modules
TFOF Thin Film PV Module Task Force
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Hide details for  Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force
5979 New Standard: Specification of indoor lighting simulator requirements for emerging PV
5980 New Standard: Test method of current-voltage (I-V) measurement in indoor lighting for DSC and OPV
6297 New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC), Part 1: Standard Testing Condition (STC).
TFOF Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force
Hide details for Building Integrated Photovoltaic (BIPV) Task ForceBuilding Integrated Photovoltaic (BIPV) Task Force
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Hide details for PV Package Performance Task ForcePV Package Performance Task Force
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Hide details for PV Reliability Test Method Task Force PV Reliability Test Method Task Force
6071 New Standard: Test Method for Polymer Foil dependent Discoloration of Silver Fingers on PV modules
6296 Reapproval of SEMI PV23, Test Method for Mechanical Vibration of Crystalline Silicon Photovoltaic (PV) Modules in Shipping Environment
6298 New Standard: Test Method for Non-Uniform Wind Loads Test for PV Module
6299 Reapproval of SEMI PV38, New Standard: Test Method for Mechanical Vibration of c-Si PV cells in Shipping Environment
TFOF PV Reliability Test Method Task Force
Hide details for Photovoltaic (PV) - MaterialsPhotovoltaic (PV) - Materials
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Hide details for PV Silicon Raw Materials Task ForcePV Silicon Raw Materials Task Force
6193 New Standard: Specification for Trichlorosilane Used in Polysilicon Production
6194 New Standard: Test Method for Determination of Hydrogen in PV Polysilicon by Inert Gas Fusion Infrared Absorption Method
TFOF PV Silicon Raw Materials Task Force
Hide details for PV Silicon Wafer Task ForcePV Silicon Wafer Task Force
5767 New Standard: Guide for Material Requirements of Internal Feeders Used in Mono-crystal Silicon Growers
6072 Revision of SEMI PV29-0212, Specification for Front Surface Marking of PV Silicon Wafers with Two-Dimensional Matrix Symbols
TFOF PV Silicon Wafer Task Force
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Hide details for PV Material Degradation Task ForcePV Material Degradation Task Force
TFOF PV Material Degradation Task Force
Hide details for PV Silicon Materials Task ForcePV Silicon Materials Task Force
TFOF PV Silicon Materials Task Force
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Hide details for Japan PV Materials Task ForceJapan PV Materials Task Force
6286 Line Items Revision to SEMI PV79-0817 Test Method for Exposure Durability of PV Cells to Acetic Acid Vapor
TFOF Japan PV Materials Task Force
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Hide details for International PV Analytical Test Methods, Metrology, and Inspection Task ForceInternational PV Analytical Test Methods, Metrology, and Inspection Task Force
5801 New Standard: Guide for the Planning, Implementing and Analyzing data from a Round Robin used to verify a Test Method
5902 Line Item of SEMI PV1-0211   Test Method for Measuring Trace Elements in Silicon Feedstock for Silicon Solar Cells by High-Mass Resolution Glow Discharge Mass Spectrometry
TFOF International PV Analytical Test Methods, Metrology, and Inspection Task Force
Hide details for Physical Interfaces & CarriersPhysical Interfaces & Carriers
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Hide details for EU Equipment Automation Committee (Physical Interfaces & Carriers)EU Equipment Automation Committee (Physical Interfaces & Carriers)
TFOF EU Equipment Automation Committee (Physical Interfaces & Carriers)
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Hide details for Global PIC Maintenance Task ForceGlobal PIC Maintenance Task Force
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Hide details for International 450 mm Physical Interfaces & CarriersInternational 450 mm Physical Interfaces & Carriers
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Hide details for International Reticle SMIF Pod and Load Port Interoperability Task ForceInternational Reticle SMIF Pod and Load Port Interoperability Task Force
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Hide details for Fiducial Mark Interoperability Task ForceFiducial Mark Interoperability Task Force
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Hide details for Japan Electron Microscopy Workflow liaison Task ForceJapan Electron Microscopy Workflow liaison Task Force
TFOF Japan Electron Microscopy Workflow liaison Task Force
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Hide details for Electron Microscopy Workflow Task ForceElectron Microscopy Workflow Task Force
6311 New Standard, Specification for TEM lamella carrier used in Electron Microscopy Workflows
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Hide details for NA 450mm Assembly Test Die Prep Task ForceNA 450mm Assembly Test Die Prep Task Force
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Hide details for International 450 mm Shipping BoxInternational 450 mm Shipping Box
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Hide details for International Advanced Wafer Geometry Task ForceInternational Advanced Wafer Geometry Task Force
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Hide details for International Annealed Si Wafer Task ForceInternational Annealed Si Wafer Task Force
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Hide details for International Automated Advanced Surface Inspection Task ForceInternational Automated Advanced Surface Inspection Task Force
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Hide details for International Epitaxial Wafers Task ForceInternational Epitaxial Wafers Task Force
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Hide details for International Polished Wafers Task ForceInternational Polished Wafers Task Force
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Hide details for International SOI Wafers Task ForceInternational SOI Wafers Task Force
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Hide details for Fiducial Mark Interoperability Task ForceFiducial Mark Interoperability Task Force
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Hide details for International Advanced Wafer Geometry Task ForceInternational Advanced Wafer Geometry Task Force
5915 Line Item Revision to SEMI M1-1016, Addition to Related Information: Illustration of Flatness Metrics for Silicon Wafers
6170 Line item Revision to SEMI M49 “Guide For Specifying Geometry Measurement Systems For Silicon Wafers For The 130 nm TO 16 nm Technology Generations
6207 Line Items Revision to SEMI M1-1016, Specification for Polished Single Crystal Silicon Wafers (Add Shape metrics of Bow 3p in appendix 2 which was mistakenly removed at previous ballot, and add Illustrations of Shape Metrics for Silicon Wafers in Appendix 2.)
Hide details for International Test Methods Task ForceInternational Test Methods Task Force
5834 Line Item Revision to SEMI M85-1014: Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry
Hide details for JA Shipping Box Task ForceJA Shipping Box Task Force
6292 Line Item Revision to modify the nonconforming title of SEMI M31-0708 MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 mm WAFERS
TFOF JA Shipping Box Task Force
Hide details for Japan AWG Task ForceJapan AWG Task Force
TFOF Japan AWG Task Force
Hide details for Japan TC Chapter of Global Technical TommitteeJapan TC Chapter of Global Technical Tommittee
TFOF Japan TC Chapter of Global Technical Tommittee
Hide details for Japan Test Method Task ForceJapan Test Method Task Force
5737 Revision of SEMI MF1391-1107, Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption
5769 New Standard: Test Method for Nitrogen Content in Silicon by Infrared Absorption
5770 New Standard: Guide For Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers
5772 Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage
5774 New Standard: Guide for Sample Preparation Method for Minority Carrier Diffusion Length Measurement in Silicon Wafers by Surface Photovoltage Method
TFOF Japan Test Method Task Force
Hide details for Test Method Task ForceTest Method Task Force
5981 NEW STANDARD: TEST METHOD FOR RECOMBINATION LIFETIME OF THE EPILAYER OF THE SILICON EPITAXIAL WAFER (p/p+, n/n+) BY THE SHORT WAVELENGTH EXCITAION MICROWAVE PHOTOCONDUCTIVE DECAY METHOD
6087 NEW STANDARD: Test method for nitrogen content in silicon by charged particle activation analysis
TFOF Test Method Task Force
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Hide details for International Advanced Wafer Geometry Task ForceInternational Advanced Wafer Geometry Task Force
6168 Line Item revision to add new Related Information about area (sector) exclusions for the ERO-related standards M67-1015: Test Method For Determining Wafer Near-Edge Geometry From A Measured Thickness Data Array Using The ESFQR, ESFQD AND ESBIR Metrics and M68-1015 Test Method For Determining Wafer Near-Edge Geometry From A Measured Height Data Array Using A Curvature Metric, ZDD
6205 Line Item Revision to SEMI M43, Guide for Reporting Wafer Nanotopgraphy
6206 Line Item Revision to SEMI M78, Guide for Determining Nanotopography of Unpatterned Silicon Wafers for the 130 nm to 22 nm Generations in High Volume Manufacturing
Hide details for International Automated Advanced Surface Inspection Task ForceInternational Automated Advanced Surface Inspection Task Force
6096 Line Item Revision to SEMI M53-0216 Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodispere Reference Spheres on Unpatterned Semiconductor Wafer Surfaces (Addition of a related information section to SEMI M53 regarding the relationship of calibrated sizes assigned to defects by surface inspection systems to their actual physical size )
Hide details for International Polished Wafers Task ForceInternational Polished Wafers Task Force
6097 Line Item Revision to SEMI M1-0416 Specification for Polished Single Crystal Silicon Wafers, to address issues with primary fiducials across text, table and figures.
6264 Reapproval of SEMI M8-0312 - Specification for Polished Monocrystalline Silicon Test Wafers
6265 Reapproval of SEMI M38-0312 - Specification for Polished Reclaimed Silicon Wafers
Hide details for International Test Methods Task ForceInternational Test Methods Task Force
6266 Reapproval of SEMI MF110-1107 (Reapproved 0912) Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique
6267 Reapproval of SEMI MF1188-1107 (Reapproved 0912) Test Method for Interstitial Oxygen Content of Silicon by Infrared Absorption With Short Baseline
6268 Reapproval of SEMI MF1388-0707 (Reapproved 0412) Test Method for Generation Lifetime and Generation Velocity of Silicon Material by Capacitance-Time Measurements of Metal-Oxide-Silicon (MOS) Capacitors
6269 Reapproval of SEMI MF1392-0307 (Reapproved 0512) Test Method for Determining Net Carrier Density Profiles in Silicon Wafers by Capacitance-Voltage Measurements with a Mercury Probe
6270 Reapproval of SEMI MF1527-0412 Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon
6271 Reapproval of SEMI MF1569-0307 (Reapproved 0512) Guide for Generation of Consensus Reference Materials for Semiconductor Technology
6272 Reapproval of SEMI MF950-1107 (Reapproved 0912) - Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Wafer Surface by Angle Polished and Defect Etching
6273 Reapproval of SEMI MF1619-1107 (Reapproved 0912) Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with p-Polarized Radiation Incident at the Brewster Angle
6274 Reapproval of SEMI MF1630-1107 (Reapproved 0912) Test Method for Low Temperature FT-IR Analysis of Single Crystal Silicon for III-V Impurities
6275 Reapproval of SEMI MF2074-0912 Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers
6276 Reapproval of SEMI MF374-0312 Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure
6277 Reapproval of SEMI MF397-0812 Test Method for Resistivity of Silicon Bars Using a Two-Point Probe
6278 Reapproval of SEMI MF523-1107 (Reapproved 1012) Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
6279 Reapproval of SEMI MF525-0312 Test Method for Measuring Resistivity of Silicon Wafers Using a Spreading Resistance Probe
6280 Reapproval of SEMI MF576-0812 Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry
6281 Reapproval of SEMI MF84-0312 - Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe
6282 Reapproval of SEMI MF671-0312 Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials
6283 Reapproval of SEMI MF95-1107 (Reapproved 1012) - Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer
6284 Reapproval of SEMI M56-0307 (Reapproved 0512) - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
Hide details for Silicon Wafer CommitteeSilicon Wafer Committee
TFOF Silicon Wafer Committee
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Hide details for 5 Year Review TF5 Year Review TF
6203 Reapproval of SEMI T22-0212: Specification for Traceability by Self Authentication Service Body and Authentication Service Body
6293 Line Item Revision to SEMI T15-0812 “General Specification of Jig ID: Concept” with non-conforming title change to “Specification for Jig ID: Concept”
TFOF 5 Year Review TF
Hide details for Fiducial Mark Interoperability Task ForceFiducial Mark Interoperability Task Force
TFOF Fiducial Mark Interoperability Task Force
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6244 Reapproval of SEMI T10-0701 (Reapproved 0912), Test Method For The Assessment Of 2d Data Matrix Direct Mark Quality
6245 Reapproval of SEMI T15-0812, General Specification Of Jig Id: Concept
6246 Reapproval of SEMI T17-0706 (Reapproved 0812), Specification Of Substrate Traceability
6247 Reapproval of SEMI T18-1106 (Reapproved 0812), Specification of Parts And Components Traceability
TFOF 5 Year Review TF
Hide details for T5 Revision Task ForceT5 Revision Task Force
6117 Line Item Revision to SEMI T5-1214, Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers
TFOF T5 Revision Task Force

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